TaoWeave expands into physical AI with investment in Manako Labs August 07, 2026 The transaction marks TaoWeave’s first operating investment in AI and expands TaoWeave’s strategy beyond digital asset treasury activities into enterprise AI deployment, commercialization and recurring operating revenue.
Siemens to acquire EDA software firm Precision Innovations August 07, 2026 Acquisition expands Siemens’ electronic design automation (EDA) portfolio with AI-powered, shift-left chip planning capabilities to support faster design exploration for advanced system-on-a-chip (SoC) architectures.
SpaceX, Tesla to initially spend $16.8 billion on Texas chip plant August 07, 2026 Terafab, a vertically integrated semiconductor fabrication plant in Grimes County, Texas, with over 100 million square feet of manufacturing space, will employ at least 3,000 people.
Rashi Peripherals announces JV with Japan’s Restar August 07, 2026 Rashi will transfer its semiconductor business division into a wholly owned subsidiary headquartered in Bengaluru and step-down subsidiary headquartered in Singapore. Restar Corporation will subsequently acquire a 26% equity stake in the subsidiary.
Asahi Kasei partners with HighChem for production, sale of Acetolyte August 07, 2026 This marks the first license agreement for Asahi Kasei’s novel electrolyte technology in China, and grants HighChem Shanghai a non-exclusive license to produce and sell the electrolyte for the local market.
Infineon, MediaTek to advance AI-driven in-cabin solutions August 06, 2026 MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1.
TE Connectivity to acquire power solutions provider Astrodyne August 06, 2026 Headquartered in New Jersey, Astrodyne is recognized for its engineering expertise and close collaboration with customers developing next-gen technologies across semiconductor manufacturing equipment, medical, defense and industrial applications.
Fuji enables SMT placement of large, heavy components for AI servers August 06, 2026 The company can handle large, heavy components measuring 200 x 200 mm and weighing 2.0 kg with the standard configurations of both its NXTR and AIMEXR pick and place machines.
MetaOptics, Elsoft to advance chip optics manufacturing tools August 06, 2026 Under the partnership, the two companies will design, build and industrialise the key fabrication equipment behind the metalens value chain, from research and development through to high-volume manufacturing.
Renesas Gen 3 MRDIMM chipset solutions advance performance August 05, 2026 Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.
Syensqo signs multi-year supply agreement with Airbus August 05, 2026 Under the contract, Syensqo will continue to supply a broad range of advanced materials from its portfolio including prepregs, RTM resins, adhesives, and primers to support Airbus programs across commercial aircraft, space & defense, and helicopter platforms.
Northrop Grumman secures $3 billion in missile defence deals August 04, 2026 US Department of War signs framework agreements with Northrop Grumman to ramp production of PAC-3, THAAD components.
Understanding semiconductor datecodes in long-lifecycle electronics August 04, 2026 The electronics industry has spent years learning to fear shortages, counterfeit components and end-of-life notices. But according to Ronny Nietzsche, Regional Sales Manager Nordic-Baltic Region at Rochester Electronics, another issue may be quietly shaping purchasing decisions — an outdated understanding of semiconductor date codes.
Alfen, CATL to deploy 5 GWh sodium-ion BESS in Europe August 04, 2026 This initiative enables Alfen to diversify its battery material portfolio, optimise the cost structure of its energy storage products and strengthen resilience against lithium price volatility.
Micross to acquire AEMtec, expanding European footprint August 04, 2026 AEMtec specializes in delivering end-to-end solutions across the entire packaging and integration value chain. The acquisition enhances Micross’ presence in continental Europe and broadens its portfolio of high-reliability microelectronic services and products.
Incap reports 21% increase in half-yearly revenue August 03, 2026 In the January–June 2026 period, Incap reported revenue of EUR 130.2 million, an increase of 21.1% from last year. It reported revenue of EUR 74.2 million for the April–June 2026 quarter, a year-on-year increase of 34.1%.
Intel partners with Lens to boost advanced semiconductor packaging August 03, 2026 Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.
German auto supplier ZF improves profitability in H1 2026 July 31, 2026 The company increased its adjusted EBIT margin to 5.0% in the first half of 2026, up from 4.3% in the previous-year period. While sales declined 2.0% on a nominal basis, ZF achieved organic growth of 0.5% despite a challenging market environment.
Confidee's answer to shortages: full transparency and the freedom to cancel orders July 30, 2026 As material shortages push lead times for advanced printed circuit boards towards 2028, four-year-old PCB supplier Confidee has built its strategy around the opposite of locking customers into rigid commitments: complete transparency and a clear policy allowing customers to cancel or rebalance production without damaging the relationship. That is according to board member Didrik Bech.
Baya Systems partners with Openchip on next-gen intelligent compute July 30, 2026 Spanish company Openchip will use US-based chiplet startup Baya Systems’ WeaveIP unified fabric to develop specialized intelligent compute systems for next-generation AI workloads.
Report: BMW aims to cut 8,000 jobs by end of 2027 July 30, 2026 BMW is the latest German carmaker to announce job cuts, following similar moves by Volkswagen, Mercedes and Volkswagen-owned Audi.
AI infrastructure boom reshapes electronics supply chain, says in4ma July 29, 2026 The unprecedented wave of investment in artificial intelligence infrastructure is transforming the global electronics supply chain, with growing consequences for PCB manufacturers, material suppliers and OEMs worldwide. According to new research from in4ma and EMSNOW, demand generated by hyperscale data centre operators is driving up PCB prices, stretching lead times and redirecting manufacturing capacity towards AI applications.
Microchip Technology signs definitive agreement to acquire Hailo July 29, 2026 The acquisition is expected to expand Microchip’s processing portfolio for intelligent edge systems and strengthen its ability to deliver accelerated, power-efficient edge AI solutions for robotics, advanced vision processing and intelligent edge applications.
German battery maker Varta files insolvency applications July 29, 2026 Key creditors, such as Deutsche Bank, intend to take over Varta’s household battery business, while Tojner has expressed interest in the micro-battery division.
FR 4 base materials: shortages, price increasing and allocations July 29, 2026 Why PCB procurement strategies should be reviewed?
Anglia sounds alarm bell on CEM/broker ‘cartel’ July 29, 2026 The issue centres on how blurred lines between manufacturing, distribution and open-market sourcing affect company governance. Anglia said it believes in forging strong, three-way supply chain partnerships between component manufacturer, the customer and the distributor.
Mitsubishi Electric, Sony to advance vision sensor solutions July 29, 2026 The two companies will establish a joint venture that will help integrate Sony’s image sensors and edge AI technologies with Mitsubishi Electric’s expertise in FA control systems.
AI data centres are consuming PCBs – Chinese lead times stretch to 2028 July 28, 2026 In an interview with Evertiq, Didrik Bech, board member of PCB supplier Confidee, described how the AI infrastructure boom is creating an unprecedented demand for materials, resulting in supply shortages that could reshape market conditions across several European industries.
The ESG bottleneck: finding time for hands-on implementation July 28, 2026 For Europe's electronics manufacturers, sustainability has become far more than a long-term ambition. Customer questionnaires, ESG platforms and an expanding regulatory framework are rapidly becoming part of everyday business, requiring companies not only to improve their environmental performance but also to demonstrate it through an increasing number of reporting frameworks.
FACC expands composite production in India with partner Kineco July 27, 2026 The components will be produced in India, comprising several thousand parts per year, with serial production scheduled to start by the end of 2027.
Nvidia, Amkor sign $1.5 billion chip packaging agreement July 24, 2026 Nvidia and Amkor Technology will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.
Apple overtakes Nvidia again to become the world's most valuable company July 22, 2026 Apple has once again become the world's most valuable publicly traded company - according to Reuters. The iPhone maker has overtaken Nvidia, which had held the top spot for nearly a year thanks to the artificial intelligence boom. Apple is now valued at about USD 4.88 trillion.