Evertiq - First In Electronics News & Expo

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quantum-technologies-1

June 05, 2026
Rather than relying on a single architecture, SEALSQ is investing into several complementary approaches to fault-tolerant quantum computing and binding them to its own QS7001 secure hardware, QVault TPM and PQC product portfolio.

Intel-deal-2026

June 05, 2026
Foxconn and Intel are teaming up to jointly develop and deploy next-generation AI infrastructure and intelligent computing platforms, combining Intel's processor and silicon capabilities with Foxconn's manufacturing scale and system integration expertise.

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3dIC

June 05, 2026
Building on the companies’ 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence portfolio of Memory and Interface IP.

axonite_chip

June 05, 2026
The technology combines micro-scaled opto-semiconductor chips capable of 12V single-chip operation with a high-voltage (HV) driver technology, enabling a reduction of more than 10% in the number of driver-related components used in hybrid and electric vehicles.

Kaston-investment

June 04, 2026
Less than eight months after acquiring Kasdon Group, NOTE has completed an investment programme at the Wolverhampton facility. The production area has been extended by 650 square metres, and the site now operates under the name NOTE Wolverhampton.

Chips-Act

June 04, 2026
The European Commission has presented the European Technological Sovereignty Package, a set of legislative and strategic measures aimed at reducing Europe's dependence on foreign suppliers in semiconductors, AI, cloud computing and open source technology.

June 04, 2026
GlobalFoundries has completed its previously announced acquisition of the ARC Processor IP Solutions business from Synopsys, combining it with its existing MIPS subsidiary to create what the company describes as a software-to-silicon capability built for physical AI applications.

Tessalia

June 04, 2026
Foxconn, Radiall and Thales laid the foundation stone of their future JV. Tessalia is expected to have 800 employees at full production. Production is expected to start at the end of 2029 and to reach more than 50 million SiP components per year by 2033.

AutoComp_Jahwa_Electronics

June 04, 2026
The partnership brings together Jahwa Electronics’ Korean engineering expertise and Tata AutoComp’s manufacturing ecosystem in India. The companies will manufacture low and high voltage PTC heaters critical for thermal management in electric and hybrid vehicles.

pcb

June 03, 2026
The war in the Middle East has disrupted supplies of raw materials used in PCBs and pushed prices sharply higher, compounding cost pressures that were already building across the electronics industry, according to industry sources and executives cited by Reuters.

Marco-Mezger-2026

June 03, 2026
For years, memory sourcing followed a familiar logic. Buyers negotiated hard, and, when prices rose, trusted that the cycle would eventually rebalance. That approach worked – until it didn’t.

TelePIX_MOU

June 03, 2026
Indian startup Bellatrix Aerospace and South Korea’s space AI solutions company TelePIX are targeting a 2028 launch and mission commencement and will also cooperate on launch operations, early orbit operations, and overall satellite mission management.

Headquarters-Durham

June 02, 2026
Silicon carbide specialist Wolfspeed has established a dedicated data centre solutions team and regional office in the San Francisco Bay Area, targeting the growing market for high-voltage power solutions in AI infrastructure. The company has hired two industry veterans to lead the effort.

June 02, 2026
French computing company Bull and Foxconn have announced a strategic partnership to manufacture AI and cloud infrastructure in Europe. The collaboration combines Bull's AI systems design and go-to-market capabilities with Foxconn's manufacturing scale, with an initial investment exceeding EUR 120 million.

NEXTY

June 01, 2026
NEXTY has been a pivotal partner for Eatron since its early Japan market entry, providing the strategic insight and technical support needed to navigate the automotive and industrial sectors.

June 01, 2026
Eigen’s inference and post-training optimization layers will be integrated directly into Nebius Token Factory, which provides enterprise-grade autoscaling endpoints and fine-tuning pipelines across all major open-source models.

geralt-computer-chip

June 01, 2026
The QUANTIX project involves an estimated investment of EUR 40 million dedicated to the development of a Semiconductor Design and Personalization Center in the Region of Murcia, with advanced capabilities in cybersecurity, post-quantum technology, AI, and RISC-V systems.

in4ma-interview-zurich

June 01, 2026
Following his keynote at Evertiq Expo Zürich, in4ma founder and analyst Dieter Weiss had an interview with Evertiq to discuss the numbers behind global EMS growth in 2025 – and what they reveal about where the European industry stands.

new-technologies_5

June 01, 2026
As a provider of high-performance semiconductors powering AI data center networking, IoT connectivity, and intelligent connected devices worldwide, Semtech brings silicon expertise and a unique perspective to the Alliance.

HBM4E

June 01, 2026
Samsung’s HBM4E delivers a stable pin speed of 14 gigabits-per-second (Gbps), with performance scalable up to 16Gbps to support increasingly intensive data processing requirements. This represents more than a 20% increase over its HBM4.

Sponsored content by Shanghai Yongming Electronic Co.,Ltd

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YMIN VHT/VHU/VHR solid-liquid hybrid capacitors for automotive electronic water pumps solve cold-start noise and high-vibration challenges. They enable pin-to-pin replacement of Japanese brands with equivalent performance and stable supply.

Kawasaki-main-office

May 29, 2026
Through this collaboration, Fujitsu will gain early access to Anthropic’s latest AI models and, by developing and delivering solutions that utilize these models, will provide customers with more advanced and practical AI applications.

May 28, 2026
US semiconductor packaging and test provider Amkor Technology has secured an additional 67-acre parcel of land adjacent to its existing campus in Peoria, Arizona, expanding its footprint for future advanced packaging and test capacity.

Torsby-Inaguration-Johannes-Lind-Widestam-Karin-Nichols

May 27, 2026
Swedish EMS provider NOTE has inaugurated a new production facility in Torsby, Värmland. The factory doubles the company's production floor space at the site and is built for advanced electronics manufacturing serving customers in defence, medical technology and other demanding segments.

2Raymond-Goh

May 27, 2026
The global raw material supply continues to pressure the electronic industry and not least the PCB manufacturing sector. What initially affected a narrow range of high-frequency materials has now evolved into a broader scope, impacting both advanced laminates and standard FR-4 materials.

May 27, 2026
Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.

Indie

May 27, 2026
The company’s architecture is designed to support real-time analytics, contextual decision-making, and seamless interoperability with customer-owned Artificial Intelligence models and digital systems.

expandedits-European-branch-to-Frankfurt

May 26, 2026
Doosan Robotics has opened an expanded European branch in Frankfurt, Germany, as part of its efforts to accelerate business growth across the region.

v-nand-8-gen

May 26, 2026
The combined revenue of the world's five largest NAND Flash suppliers jumped 83.7% quarter-on-quarter in the first quarter of 2026, surpassing USD 38.9 billion. Surging demand for enterprise SSDs from AI infrastructure buildout, combined with constrained supply, pushed prices well above expectations, according to TrendForce.

Expo-ber25-9

May 26, 2026
The German electronics industry is entering a period defined less by stability and more by adaptation. For years, the sector benefited from a model built on industrial strength, global supply chains and close ties between manufacturing and export-driven growth. Today, many of those assumptions are being re-evaluated.

May 26, 2026
US memory manufacturer Micron has begun 1-alpha DRAM manufacturing at its Manassas, Virginia facility — the most advanced memory technology ever produced in the United States, according to the company. The more than USD 2 billion investment will quadruple Micron's DDR4 wafer supply at the site.

May 25, 2026
Currently, China’s most advanced proven chipmaking capability is believed to be around 7nm, and experts say 1.4nm is likely the global limit for advanced chipmaking around the end of the decade. So the Chinese tech giant’s claims could represent a breakthrough.

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