Evertiq - First In Electronics News & Expo

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Systems_logo

July 03, 2026
The round co-led by Blackstone, Noteus, Airbus and Advent supports Quantum Systems’ industrial scale-up as a leading deep-tech prime for interoperable, multi-domain autonomous capabilities in Europe.

Liquide

July 03, 2026
Air Liquide will deliver large volumes of nitrogen, oxygen, argon, hydrogen and other industrial gases to SK hynix’s new cutting-edge advanced chips packaging facility.

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Factory_North_Carolina

July 03, 2026
The project, supported by a state-level incentive package, will be home to production of JetZero’s next-generation aircraft and is expected to create 14,500 jobs over the next 10 years.

Robotics

July 03, 2026
The acquisition transitions the Fort platform into an intelligent, proactive system where autonomous machines can not only communicate safely but also actively read their environments, anticipate potential hazards, and execute real-time operational decisions on the fly.

building_logo

July 03, 2026
Building off the first successful three transmit antennas (3Tx) advancement, this trial integrated 3Tx, leveraging a multi-band setup that combined n66 (1.7GHz) as the primary cell and dual n77(3.7GHz) carriers across five uplink layers, delivering speed and efficiency.

logos-on-buildings

July 02, 2026
ams OSRAM has completed the sale of its non-optical analog/mixed-signal sensor business to Infineon Technologies in a transaction valued at EUR 570 million.

Recharge_SINEXCEL_lab

July 02, 2026
The Joint Laboratory in Shenzhen will serve as a hub for technical exchange, collaborative R&D, project incubation and pilot exploration with a focus on areas such as ultra-fast charging, cloud-charger synergistic scheduling and megawatt charging.

pcb

July 01, 2026
PCB manufacturer Somacis Group has completed the acquisition of Group ACB, a PCB manufacturer with two sites in France and one in Belgium.

Kingboard-Laminate

July 01, 2026
Kingboard Holdings has sold a 4.92% stake in its laminates subsidiary, Kingboard Laminates Holdings, raising net proceeds of approximately HKD 11.8 billion – roughly EUR 1.4 billion. The capital is earmarked for PCB capacity expansion and multi-layer and HDI capabilities.

saic-volkswagen-shanghai

July 01, 2026
Volkswagen is reportedly planning to end its partnership with Bosch on the development of advanced driver assistance systems (ADAS) and autonomous driving technology. According to German newspaper Bild, which cited anonymous sources, the project failed to meet expectations despite investments of around EUR 1.5 billion.

building

July 01, 2026
Fujifilm India aims to assess opportunities to establish a semiconductor materials production base in Dholera, Gujarat, while working closely with government stakeholders, industry bodies and private enterprises to strengthen a semiconductor supply chain.

cockpit

June 30, 2026
Firan Technology Group has held the grand opening of FTG Aerospace Hyderabad, marking the culmination of a three-year effort to establish operations in India. The facility produces cockpit and avionics products and becomes FTG's fourth global manufacturing location, alongside Canada, the United States and China.

Duo-column

June 29, 2026
Dennis Dahlgren and Ewelina Bednarz reflect on the spring Expo season and look ahead to their first trip to the International in4ma EMS & PCB Forum in Würzburg.

axonite_chip

June 29, 2026
While conventional ESD protection devices were primarily limited to controlling momentary discharges during chip manufacturing or assembly processes, the new technology enables complete on-chip control of harsh system-level EMC environments.

new-technologies_5

June 29, 2026
Cadence Tensilica Vision DSPs deliver a unique combination of programmability and performance, enabling Aeva to add flexibility, scalability and customizations to the lidar processing pipeline.

UFS5

June 26, 2026
The enhanced performance is expected to allow mobile device users with significantly reduced latency and faster response times when running large language models (LLMs) in on-device AI environments.

June 26, 2026
Building on onsemi’s expertise in automotive, industrial and AI data center, the combined platform is intended to position onsemi at the center of Physical AI.

June 26, 2026
At full deployment, 30 MW of dedicated AMD compute across Rackspace’s footprint will represent meaningful capacity to serve regulated enterprise workloads, including healthcare providers who have expressed early interest in accelerated compute.

June 25, 2026
Qualcomm has agreed to acquire Modular Inc, an AI software infrastructure company whose platform allows developers to build and deploy AI across different hardware architectures without rewriting code for each one. The deal is expected to close in the second half of 2026.

Peter-Kruk-pcbs

June 25, 2026
NCAB has acquired PCB solutions provider Board Shark LLC, based in Florida in the United States. The company generated USD 17 million in net sales during 2025, with profitability exceeding NCAB's own margins.

expo-Berlin-2026-05

June 25, 2026
Siemensstadt was a deliberate choice for the move of Evertiq Expo Berlin. The district was once a city within a city – an entire industrial ecosystem built around a single company, now being reimagined for the next generation of technology. It felt like the right place for a day spent discussing what European electronics manufacturing is, and what it needs to become.

IIT_Hyderabad_MOU

June 25, 2026
As part of this collaboration, the Centre for Development of Telematics (C-DOT) is establishing a Centre of Excellence (CoE) at IIT Hyderabad to accelerate research, innovation and capacity building in advanced communication domains in India.

Munich-facility

June 24, 2026
The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.

quantum-technologies-1

June 24, 2026
By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.

Space_AI

June 24, 2026
The investment will accelerate the commercial rollout of Irish firm Ubotica’s Live Maritime Intelligence platform, which enables governments and maritime agencies to detect emerging threats across maritime territories in real time.

sign

June 24, 2026
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.

Linz-facility

June 23, 2026
A Munich district court has ruled in favour of Infineon Technologies in two further patent infringement cases against Chinese GaN manufacturer Innoscience. It is the third and fourth legal defeat for Innoscience in an ongoing series of proceedings across Germany and the United States.

Cathie-Gridley-EVP-and-President-Aerospace-Defense

June 23, 2026
TTM Technologies has opened a new Ultra-HDI printed circuit board manufacturing facility in Syracuse, New York, in the United States. The USD 130 million investment – including USD 30 million from the US Department of War – is set to create up to 400 new jobs and bring TTM's total workforce in the region to approximately 1,000.

Prologium_MOU

June 23, 2026
France’s OPmobility will be responsible for the design, development and manufacturing of battery modules utilizing the solid-state battery cells provided by Taiwanese company ProLogium.

expo-Berlin-2026-01

June 22, 2026
Evertiq Expo Berlin 2026 took place on June 18 at TEC Event Campus in Berlin's Siemensstadt district – a new venue for the event, which previously called Technology Park Berlin Adlershof home. The day brought together 328 people from 199 companies, with 163 visitors meeting 78 exhibiting companies.

data_centers

June 22, 2026
Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure

hynix_HBM4E

June 19, 2026
The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models.

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