Samsung unveils ‘industry’s fastest’ UFS 5.0 solution June 26, 2026 The enhanced performance is expected to allow mobile device users with significantly reduced latency and faster response times when running large language models (LLMs) in on-device AI environments.
onsemi to acquire Synaptics in $7 billion all-stock deal June 26, 2026 Building on onsemi’s expertise in automotive, industrial and AI data center, the combined platform is intended to position onsemi at the center of Physical AI.
AMD partners with Rackspace to deploy 30 MW of AMD AI compute June 26, 2026 At full deployment, 30 MW of dedicated AMD compute across Rackspace’s footprint will represent meaningful capacity to serve regulated enterprise workloads, including healthcare providers who have expressed early interest in accelerated compute.
Qualcomm acquires AI software company Modular June 25, 2026 Qualcomm has agreed to acquire Modular Inc, an AI software infrastructure company whose platform allows developers to build and deploy AI across different hardware architectures without rewriting code for each one. The deal is expected to close in the second half of 2026.
NCAB acquires Board Shark PCB in the United States June 25, 2026 NCAB has acquired PCB solutions provider Board Shark LLC, based in Florida in the United States. The company generated USD 17 million in net sales during 2025, with profitability exceeding NCAB's own margins.
Evertiq Expo Berlin 2026 – through the lens June 25, 2026 Siemensstadt was a deliberate choice for the move of Evertiq Expo Berlin. The district was once a city within a city – an entire industrial ecosystem built around a single company, now being reimagined for the next generation of technology. It felt like the right place for a day spent discussing what European electronics manufacturing is, and what it needs to become.
C-DOT, IIT Hyderabad to advance next-gen communication tech June 25, 2026 As part of this collaboration, the Centre for Development of Telematics (C-DOT) is establishing a Centre of Excellence (CoE) at IIT Hyderabad to accelerate research, innovation and capacity building in advanced communication domains in India.
EU clears €76 million German state aid for QuantumDiamonds June 24, 2026 The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.
QCi acquires NHanced in deal valued at up to $145 million June 24, 2026 By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.
Ubotica raises $11M to scale real-time maritime intelligence June 24, 2026 The investment will accelerate the commercial rollout of Irish firm Ubotica’s Live Maritime Intelligence platform, which enables governments and maritime agencies to detect emerging threats across maritime territories in real time.
TSMC partners with Amkor to accelerate advanced packaging in US June 24, 2026 The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.
Infineon wins two more patent cases against Innoscience in Germany June 23, 2026 A Munich district court has ruled in favour of Infineon Technologies in two further patent infringement cases against Chinese GaN manufacturer Innoscience. It is the third and fourth legal defeat for Innoscience in an ongoing series of proceedings across Germany and the United States.
TTM Technologies opens Ultra-HDI PCB facility in Syracuse June 23, 2026 TTM Technologies has opened a new Ultra-HDI printed circuit board manufacturing facility in Syracuse, New York, in the United States. The USD 130 million investment – including USD 30 million from the US Department of War – is set to create up to 400 new jobs and bring TTM's total workforce in the region to approximately 1,000.
OPmobility, ProLogium sign MoU to develop solid‑state battery packs June 23, 2026 France’s OPmobility will be responsible for the design, development and manufacturing of battery modules utilizing the solid-state battery cells provided by Taiwanese company ProLogium.
Evertiq Expo Berlin 2026 wraps up the first half of the year June 22, 2026 Evertiq Expo Berlin 2026 took place on June 18 at TEC Event Campus in Berlin's Siemensstadt district – a new venue for the event, which previously called Technology Park Berlin Adlershof home. The day brought together 328 people from 199 companies, with 163 visitors meeting 78 exhibiting companies.
Cadence, HPE accelerate digital twin–driven data center modernization June 22, 2026 Solution will maximize data center and AI factory profitability while delivering engineering-grade insights to design and operations for more efficient, sustainable, and resilient infrastructure
SK hynix ships samples of 12-layer next-gen HBM4E June 19, 2026 The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models.
Edge, Safran sign deal to deepen aerospace, defense cooperation June 19, 2026 The two companies have also announced a joint venture term sheet for the co-development of an extended-range precision-guided weapon based on the Hammer family.
Europe's top 20 EMS companies: a fragmented landscape with pockets of strength June 18, 2026 With 31 companies in the global EMS/ODM Top 100, Europe has breadth – but not scale. A look at the region's top 20 reveals a manufacturing base spread across 14 countries, led by Germany and with the Nordics punching well above their weight.
Siemens, HighByte partner on industrial data operations June 18, 2026 Using HighByte Intelligence Hub, users can apply flexible and scalable transformation rules to process data from multiple sources across IT and OT domains, adding business context and converting raw operational data into meaningful information.
TTM Technologies expands into the Swiss and German PCB markets June 18, 2026 U.S.-based TTM Technologies has announced plans to acquire Switzerland’s Swiss Technology Group and Germany’s ILFA GmbH. Both transactions are expected to be completed in the third quarter of 2026.
Atom Computing raises $300M to advance quantum computing June 17, 2026 The US-based company plans to accelerate the development and deployment of commercial-scale fault-tolerant quantum computers. Atom Computing recently announced a full demonstration of quantum error correction on its quantum computers.
Aukera commissions first phase of Gura BESS in Romania June 17, 2026 This marks Aukera’s first operational BESS project in Romania and a significant step in the delivery of the Belgian company’s 250 MW/500 MWh Gura project. Phase two representing an additional 100 MW will soon be under construction.
QBit Semiconductor acquires 60% stake in Singapore’s SinChip June 17, 2026 This move will complement QBit’s existing high-performance SoC platforms, boosting its ASIC design services capability and amplifying the Taiwanese company’s market layout across Edge AI, HPC, optical communications and automotive sectors.
Nyobolt raises $60 million to power rise of autonomous machines June 17, 2026 New funding to advance UK-based company Nyobolt’s aim to deliver instant power for demanding robotics and automation applications and AI data centres.
GE Aerospace, Wolfspeed to accelerate high-voltage SiC adoption June 17, 2026 The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.
Rapidus, Fondazione Chips-IT sign MoU to boost chip manufacturing June 17, 2026 The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.
Europe lags behind globally – but who leads its EMS industry? June 16, 2026 Europe has long been regarded as a manufacturing powerhouse. Yet in electronics manufacturing services (EMS), the continent faces an increasingly difficult challenge: keeping pace with competitors in Asia.
Börje Ekholm steps down as CEO of Ericsson – Per Narvinger takes over June 16, 2026 Ericsson has announced that Börje Ekholm is stepping down as President and CEO, with Per Narvinger appointed as his successor. Narvinger, currently Executive Vice President and Head of Business Area Networks, takes over on October 1, 2026.
Cicor divests Tunisia facility and launches efficiency programme June 16, 2026 Swiss EMS provider Cicor is divesting its Tunisia production facility and launching an integration and productivity programme expected to deliver recurring EBITDA improvements of more than CHF 10 million annually. The programme affects approximately 220 positions, equivalent to 5% of the company's total headcount.
Cellula, Metron sign agreement to advance US undersea capability June 16, 2026 The 10-year agreement brings together Cellula Robotics’commercial off-the-shelf (COTS) long-endurance autonomous underwater vehicle (AUV) platforms with Metron’s adaptive mission autonomy and undersea warfare and maritime domain expertise.
Semiconductor market hits record quarter, driven by memory surge June 16, 2026 Semiconductor revenue grew 27% QoQ in Q1 2026 to reach USD 319 billion – the highest quarterly growth Omdia has recorded since it began tracking the market in 2002. It marks the third consecutive quarter of double-digit growth, putting the market on track to surpass USD 700 billion in the first half of 2026.