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TungLam_electronicwaste

September 11, 2026
There is a gap between ambition and action on circularity in the Swedish electronics industry, according to Elisabet Österlund, Secretary General of Svensk Elektronik. For circularity to become more than a sustainability talking point, stronger incentives are needed from both industry and government.

LG_UWB

September 11, 2026
The collaboration pairs Ceva-Waves UWB baseband IP and software with UWB radio frequency (RF) technology developed by LG's SoC Center, giving customers a silicon-ready platform for integrating UWB into their SoCs. LG's UWB RF supports TSMC's 22nm process.

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electronic_system_design

September 11, 2026
By integrating EMA and FlowCAD technology into the Cadence ecosystem, the company is building on a collaboration that spans over 20 years. Deeper integration with Allegro X and OrCAD X platforms will enable scalable library and data management capabilities.

Kongsberg-2026

September 09, 2026
WB Electronics, part of Poland's WB Group, and Norway's Kongsberg have signed a cooperation agreement to develop unmanned maritime systems. The companies aim to jointly create autonomous platforms equipped with reconnaissance systems, communications, command-and-control solutions, and weapon systems.

SECO-deal

September 09, 2026
German humanoid robotics company NEURA Robotics and Italian embedded computing specialist SECO have announced a strategic partnership to industrialise and scale Physical AI from Europe. SECO will design, engineer and manufacture electronic compute modules for NEURA's cognitive robots, including the humanoid 4NE1, integrating Qualcomm Dragonwing processors.

Copenhagen-Quantum-fab

September 08, 2026
Quantum Foundry Copenhagen and the Novo Nordisk Foundation have announced plans to establish a 5,300 square metre quantum chip fabrication facility in Copenhagen, Denmark. The facility is expected to open in 2027 and will develop and scale manufacturing capabilities for next-generation quantum chips.

September 08, 2026
Intel Foundry and ASML have reported continued progress in High NA EUV lithography production, including more than one million wafers processed to date across early tool certification and testing, research and development, and volume production on select layers of Intel's Panther Lake processors — part of the Core Ultra Series 3 family.

axonite_chip

September 07, 2026
The tender is for the supply of electronic packaging products in 2027-2028 to a global company in the medical industry.

cosmos-2

September 03, 2026
Indian space tech company Kepler Aerospace is focused on enabling reliable, secure and scalable space missions across strategic, defence and commercial applications, with a focus on persistent, low-latency intelligence from space.

Data_Center_Akela999

September 03, 2026
Including this customer, Samsung Electro-Mechanics has signed long-term MLCC supply agreements (LTAs) with over 10 global companies. The company said it is also in discussions for long-term supply contracts with several global companies.

jo-Nordvoll-Erik-Dragset-Cattle-Collar

September 02, 2026
Inission has secured a new order from Norwegian Nofence, a developer of virtual fencing solutions for agriculture, with deliveries scheduled over the coming year. The order covers the production of Nofence’s electronic solutions for the Swedish market.

Lamphun-Thailand-render

September 02, 2026
Murata Manufacturing is investing approximately JPY 6.2 billion (approximately EUR 33.3 million) in a new four-storey production building at its manufacturing subsidiary in Lamphun, Thailand. Construction begins in September 2026 and is expected to complete in November 2027.

Gongju_plant

August 31, 2026
The facility makes ultra-high-purity chemicals that go into the semiconductor supply chain. Indichem is a Korean step-down subsidiary of Acutaas Chemicals Limited, an Indian manufacturer of specialty chemicals and pharmaceutical intermediates.

Cobot-cell-germany

August 27, 2026
Finnish EMS provider Scanfil has implemented a fully automated test cell at its Wutha production site in Germany. The solution combines robotics and process control to automate the testing and sorting of electronic assemblies.

axonite_chip

August 27, 2026
Navitas’ potential acquisition of Claros would extend the company’s AI infrastructure portfolio from the grid all the way to the xPU by bringing industry-leading VPD and IVR capabilities that can directly power the high-current, high-speed processors at the heart of modern AI systems.

Oita_building

August 24, 2026
This investment will significantly expand production capacity for post-CMP cleaners used in the manufacturing of advanced semiconductors, including those for AI applications, for which demand is growing rapidly.

GeneSiC

August 24, 2026
Under the terms of the agreement, Magnachip will license Navitas’ GeneSiC Trench-Assisted PlanarTM (TAP) technology to enter the HV and UHV SiC markets. The license covers 1200 V, 2300 V, 3300 V and higher voltage GeneSiC technologies.

Electronics_Ananth_Tech

August 21, 2026
The partnership will focus on indigenous design and development, system engineering, electronics manufacturing, integration, testing and production for current and future programmes of strategic importance.

Kingboard-Laminate

August 19, 2026
The PCB industry's material shortage is no longer confined to advanced laminates. According to a market update from Norwegian PCB supplier Confidee, the shortage has now spread to standard FR-4 and thicker copper-clad laminates – and conditions are not expected to ease through 2026 or into 2027.

Opens-Manufacturing-Center-of-Excellence-for-Defense-Electronics-Rochester

August 19, 2026
CACI International has opened a 61,000-square-foot Manufacturing Centre of Excellence for Defence Electronics in the Greater Rochester area in New York, in the United States. The facility increases CACI's manufacturing space by more than 300% and will serve as the primary production hub for the company's electronic warfare technologies.

Airbus-cooperation

August 19, 2026
Danish defence technology company Terma and Airbus Helicopters have signed a memorandum of understanding to expand their industrial partnership. The agreement covers advanced manufacturing, electronic warfare system integration, research and development, and maintenance, repair and overhaul services.

August 18, 2026
TTM Technologies has entered into a definitive agreement to acquire Epiq Design Solutions, a provider of software-defined radios, high-performance RF products and space compute solutions for defence and signals intelligence applications. The all-cash purchase price is USD 1.1 billion.

Systems_TUALCOM_MOU

August 14, 2026
The agreement between BAE Systems and TUALCOM establishes a strategic framework for both organisations to investigate opportunities to integrate advanced communications, resilient navigation and electronic warfare technologies into future autonomous platforms.

Optics_satellite_comm

August 13, 2026
The company’s initial focus is addressing the limitations of current satellite communication technology by building optical communication systems designed for scale. Its hardware is smaller, lighter, and easier to produce in large volumes.

Vehicle_Electronics_office

August 10, 2026
The acquisition expands Omega Holdings’ capabilities in the vehicle electronics category. Following the transaction, the acquired aftermarket business will continue to operate as a standalone business under the Omega Holdings group.

EDA

August 07, 2026
Acquisition expands Siemens’ electronic design automation (EDA) portfolio with AI-powered, shift-left chip planning capabilities to support faster design exploration for advanced system-on-a-chip (SoC) architectures.

Liquide_gas_plant

August 06, 2026
Scheduled to begin operations in 2028, Air Liquide’s production unit will deliver large volumes of ultra-pure nitrogen, oxygen and argon, essential for manufacturing advanced memory chips.

Esri_MOU

August 05, 2026
The two companies seek to leverage opportunities in the defence sector by combining BEL’s domain expertise in defence electronics and systems integration with Esri’s geographic information system (GIS), location intelligence and GeoAI capabilities.

August 04, 2026
Under the agreement, Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure in Phoenix, Arizona.

Kaplan_Waldom

July 31, 2026
Kaplan, former President and CEO of Cornell Dubilier Electronics, brings nearly four decades of leadership experience in the electronic components industry.

PCB-world_1

July 30, 2026
SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.

new_products

July 30, 2026
New supplier additions in Q2 include Neutrik Group, a global manufacturer of professional interconnect solutions; LumenRadio, which specializes in wireless control technology; and AMobile, which delivers industrial mobile computers.

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