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ACCM expands US capacity for AI substrate materials that don’t rely on T-glass
US materials company Advanced Chip and Circuit Materials (ACCM) is expanding its manufacturing capacity in La Crosse, Wisconsin, for its Celeritas family of dielectric materials for AI hardware. None of the materials depends on T-glass or quartz fabric, which are in short supply.
Prepreg and build-up capacity will reach 87 million square feet (about 8.1 million square metres) a year this month, and new laminate capacity of 20 million square feet (about 1.9 million square metres) a year comes online in January 2027, according to a press release from ACCM. Larger expansions of both are planned for the second half of 2027. According to ACCM, the materials are made on a raw material supply chain independent of the conventional CCL chain, with lead times of typically three weeks.
The expansion covers four segments: ultra-low-loss materials without woven glass for 224G-class switch and backplane designs, low and negative expansion laminates for large accelerator boards, core materials for IC substrates and packages, and build-up materials. ACCM says the materials are halogen-free and PFAS-free, and can be processed on the lamination, drilling and plating equipment PCB makers already use.
ACCM is also opening a second materials characterisation laboratory at the Wisconsin facility. The company has not disclosed the size of the investment or how its capacity compares with demand.
