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building

January 23, 2026
The Georgia facility is designed for 2 GWh of initial annual production capacity, scalable to up to 8 GWh, and is expected to begin mass production in mid-2026.

January 22, 2026
German semiconductor company Elmos Semiconductor has opened a new research and development site in Brno, Czech Republic.

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Robotics_Leadership

January 22, 2026
The funding, led by ICICI Venture and Redstart Labs (Infoedge), with co-investment from F-Prime, 3one4 Capital, Navam Capital, Force Ventures and others, will be used to strengthen the leadership and engineering teams, accelerate product development and expand market presence.

MaiaSpace

January 22, 2026
With its large 3.5-meter diameter fairing, a launch mass capability of up to 4 tons in inclined orbits, and the addition as an option of the Colibri kick-stage increasing mission flexibility, MaiaSpace offers solutions for various missions.

January 21, 2026
Electronics manufacturer Jabil has made a strategic minority investment in US-based Eagle Harbor Technologies, operating under the name EHT Semi, and entered into a manufacturing collaboration focused on RF and pulsed-power systems for advanced semiconductor manufacturing.

headquarters

January 21, 2026
IPValue Management, Inc. has granted California-based Sandisk Corporation a worldwide, nonexclusive patent license to a patent portfolio held by IPValue’s affiliate Longitude Flash Memory Solutions, Ltd. that originated from Cypress Semiconductor.

Bearings_Ahamani

January 21, 2026
By combining Ahamani’s advanced drone platforms, power systems and control technologies with NBC’s precision engineering expertise and manufacturing scale, the partnership aims to address rapidly growing demand across all drone applications.

opens-new-site-in-Malaysia

January 20, 2026
US-based AI semiconductor company Syntiant has opened a new manufacturing and research facility in Penang, Malaysia.

January 20, 2026
Jabil has acquired Hanley Energy Group, a specialist in energy management and critical power solutions for data centers.

factory

January 20, 2026
Under the comprehensive agreement, the two companies will scale fully connected production of Altris’ patented sodium-ion cathode active material (CAM) at Draslovka’s facility in Kolín, Czech Republic, supplying up to 350 tonnes of CAM annually.

New_Building

January 20, 2026
The electronics industry continues to expand, driven by advances in development technologies related to semiconductors. Taiyo Nippon Sanso Corporation (TNSC) will construct the new facility to create innovative and original new products in response to these technological advances.

opening-Chiang-Mai-Thailand

January 19, 2026
German EMS provider Zollner has opened a new cleanroom facility at its Bluechips Microhouse site in Chiang Mai, Thailand. The new facility is ISO Class 7 certified and covers an area of 1,000 square metres.

EEC

January 19, 2026
This acquisition will enhance Leonardo’s capabilities in the meteorological business, led by Leonardo Germany, and strengthen its position as a provider of turnkey environmental system solutions based on remote sensing applications by radar, lidar or satellite.

January 19, 2026
The acquisition includes an existing 300mm fab cleanroom of 300,000 square feet and will further position Micron to address growing global demand for memory solutions.

January 19, 2026
The two companies will collaborate to drive innovation in GenAI, hybrid cloud and high-performance computing, helping enterprises to accelerate AI adoption.

quantum-computer_geralt

January 16, 2026
Under the agreement, US company IonQ will deliver its next-generation Tempo 100 quantum system to support the Korea Institute of Science and Technology Information (KISTI’s) hybrid quantum-classical research initiatives.

Aster_PCB

January 16, 2026
This integrates Aster’s advanced “shift-left” design for test (DFT) functionality directly into Siemens’ Xpedition software and Valor software — part of the Siemens Xcelerator portfolio of industry software — establishing a comprehensive portfolio for electronic systems design.

PCB-USA_1

January 16, 2026
The investment will allow SRC Technologies to build a low-volume, high-mix circuit board assembly line — expanding its capacity to produce and remanufacture advanced electronics in-house, in Missouri.

Corporation_building

January 15, 2026
Under the agreement, Cabot Corporation will supply its advanced conductive carbons and conductive dispersions for use in EV battery electrodes.

January 15, 2026
This endeavor fast-tracks the deployment of intelligent motion sensing into smart home devices, opening the door for powerful new services across home automation, security and energy management.

Andes_Technology

January 15, 2026
The agreement establishes a scalable framework for long-term intellectual property (IP) collaboration and innovation enabling LTSCT to accelerate the development and commercialization of RISC-V based advanced, customized semiconductor solutions for global markets.

January 14, 2026
GlobalFoundries has signed a definitive agreement to acquire Synopsys’ ARC Processor IP Solutions business, expanding its processor and AI-related capabilities.

SAR_satellite

January 14, 2026
This project uses a Private Finance Initiative to build and operate a satellite constellation through private-sector leadership. The initiative aims to provide persistent imagery intelligence that strengthens Japan’s defense posture through enhanced situational awareness and reconnaissance capabilities.

ABS

January 14, 2026
The collaboration aims to create new insights into how lithium-ion battery systems behave under extreme conditions, ultimately enhancing design verification, safety assurance, and risk mitigation for next-generation applications.

businessman-hand-touching-virtual-screen

January 14, 2026
Amphenol Corporation has completed its previously announced acquisition of CommScope’s Connectivity and Cable Solutions (CCS) business, the company said on January 12.

headquarters

January 14, 2026
Kimball Electronics will hold a ribbon-cutting ceremony on February 6, 2026, to mark the opening of a new medical manufacturing facility in Indianapolis.

January 13, 2026
Farnell has entered into a new global distribution partnership with Fulham, expanding access to advanced LED drivers, emergency lighting and intelligent control solutions for customers across EMEA.

RFID-hub-italy

January 13, 2026
In mid-December 2025, Murata ID Solutions inaugurated its “RFID Experience & Innovation Hub” in Parma, Italy, an advanced laboratory dedicated to IoT (Internet of Things) and RFID (Radio Frequency Identification) technology.

Forge_Agile_MOU

January 12, 2026
Driven by Bharat Forge’s domain expertise and Agile Robots’ intelligent robots and automation solutions, this collaboration will see the deployment of cutting-edge solutions for the automotive, healthcare, and consumer electronics industries.

new-technologies_5

January 12, 2026
Eagle-A is designed for advanced driver assistance and autonomous driving systems, combining a high-end NPU, CPU and GPU with dedicated sensing interfaces for camera, LiDAR and radar fusion.

Photonic

January 12, 2026
The Canadian company is accelerating the path to fault‑tolerant quantum systems with their Entanglement First Architecture that combines silicon‑based qubits and native photonic connectivity, enabling seamless scaling across existing global telecom infrastructure.

Sponsored content by PEDC

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The Pan-European Electronics Design Conference (PEDC) will take place on 21–22 January 2026 in Prague (www.pedc.eu). Hosted by Fachverband Elektronikdesign und fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community. The conference focuses on connecting the European electronics industry and the scientific community and highlights the latest developments in electronics design from “silicon to systems.” Topics will include development, design for excellence (DfX), software and tools, and electronic systems design process.

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