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The Pan-European Electronics Design Conference (PEDC) will take place on 21–22 January 2026 in Prague (www.pedc.eu). Hosted by Fachverband Elektronikdesign und fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community. The conference focuses on connecting the European electronics industry and the scientific community and highlights the latest developments in electronics design from “silicon to systems.” Topics will include development, design for excellence (DfX), software and tools, and electronic systems design process.

hynix_DDR5_RDIMM

January 09, 2026
As an Intel Data Center Certified system/platform, 256GB DDR5 RDIMM has completed extensive testing and rigorous validation by Intel’s Advanced Data Center Development Laboratory.

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Nvidia_industrial_manufacturing

January 09, 2026
Together, the companies aim to develop industrial and physical AI solutions that will bring AI-driven innovation to every industry and industrial workflow, as well as accelerate each others’ operations.

Josh-Hollin

January 08, 2026
EMS provider Benchmark Electronics has appointed Josh Hollin as Senior Vice President and Chief Technology Officer (CTO).

MLC-NAND-Flash-capacity

January 07, 2026
Global production capacity for MLC NAND flash is expected to decline by 41.7% year-on-year in 2026 as leading memory manufacturers continue to scale back or discontinue output, according to new research from TrendForce.

worker-holding-board

January 07, 2026
PCB supplier NCAB has appointed Kelly Davidson as president of NCAB North America. Davidson previously served as vice president of the company’s North American operations.

Battery_Alexandra_Koch

January 07, 2026
The project is to be executed within 18 months from the date of signing the Battery Energy Storage Purchase Agreement (BESPA) and regulatory approvals.

li-battery_2

January 06, 2026
The plant will focus on the production of high-performance cells and battery packs tailored for utility-scale storage systems, electric mobility, and distributed energy applications.

chip

January 02, 2026
onsemi will pair its silicon drivers, controllers and thermally enhanced packages with GlobalFoundries’ 650V GaN technology platform to deliver optimized gallium nitride (GaN) devices with higher power density and efficiency.

Netcontrol

December 29, 2025
ABB’s electrification portfolio combined with Netcontrol’s advanced grid automation solutions will help customers on their journey to digitalize the power grid. Headquartered in Helsinki, Netcontrol has around 100 employees.

funds_PabitraKaity

December 26, 2025
The capital will be deployed across multiple initiatives, including scaling manufacturing capacity, strengthening research and development, advancing product engineering and supporting participation in large and complex aerospace and defence programmes.

ZF_acquisition

December 26, 2025
By integrating ZF’s Advanced Driver Assistance Systems (ADAS) capabilities with Harman’s flagship Digital Cockpit offerings within a centralized compute design, the acquisition bolsters Harman’s roadmap for next-generation vehicle architectures.

Electronics_logo

December 23, 2025
Among the product offerings are Telit Cinterion’s LE910Q1 and LE910R1 LTE Cat 1bis modules, developed specifically to support IoT applications, including a wide range of value-oriented applications that require reliable data speed and global coverage.

PCB-India_3

December 23, 2025
The collaboration with AOI Electronics positions Kaynes Semicon to deliver turnkey backend semiconductor solutions to global customers. Through the partnership with Mitsui, Kaynes expects to gain access to critical raw materials.

office

December 22, 2025
Through this acquisition, Hanwha Engine plans to expand its propulsion portfolio by combining its existing dual fuel engine expertise with Seam’s electric propulsion and power automation technologies.

Tata_Electronics

December 22, 2025
As the first step in this collaboration, Tata Electronics will assemble and test Rohm’s India-designed automotive-grade Nch 100V, 300A Si MOSFET in a TOLL package, targeting mass production shipments by next year.

Congratulates-SMTo-Engineering-Opening-Office-Mexico

December 22, 2025
SMTo Engineering has opened a new office in Tijuana, Mexico, expanding its presence in northern Mexico and strengthening local customer support for the electronics manufacturing sector. The new office is located in Baja California and will serve customers across the region.

Rockwell_Automation

December 22, 2025
This collaboration combines Chang Robotics’ expertise in deploying large-scale, complex robotic systems with OTTO’s AMR technology to deliver integrated solutions that enhance productivity, flexibility, and efficiency across North American production lines and warehouses.

ICEYE_satellite

December 22, 2025
To deliver this capability, Rheinmetall has partnered with ICEYE to establish Rheinmetall ICEYE Space Solutions. Based in Neuss, the joint venture will provide a high volume of SAR images via its exclusive constellation.

Semiconductors

December 19, 2025
It brings together Cyient Semiconductors’s design expertise with Kinetic Technologies’s portfolio of high-performance analog and mixed-signal ICs, including power conversion solutions, display power, protection and interface solutions.

Encory_Direct_Recycling

December 19, 2025
The direct recycling methodology, developed by experts from the BMW Group, eliminates the conventional, energy-intensive chemical or thermal processing previously required.

US-facility

December 19, 2025
EMS provider Kitron has received an order valued at EUR 44 million for the production and supply of advanced electronic components used in energy storage and electric grid balancing systems.

datacentre

December 19, 2025
Qualcomm Incorporated has completed its acquisition of Alphawave IP Group, also known as Alphawave Semi, approximately one quarter ahead of the originally planned schedule. The move is aimed at strengthening Qualcomm’s expansion into the data centre market.

satellite

December 19, 2025
The tailored solution leverages satellites equipped with various sensors to provide real-time data for intelligence, surveillance, reconnaissance and situational awareness.

December 18, 2025
ASMPT said it has secured new orders for 19 chip-to-substrate (C2S) thermo-compression bonding (TCB) tools from an unnamed outsourced semiconductor assembly and test (OSAT) provider supplying a leading foundry focused on AI chips.

Chip

December 18, 2025
Avnet Silica has entered into a new franchise agreement with DeepX, a South Korea-based hardware and software manufacturer specialising in highly efficient, powerful AI semiconductor technology.

December 17, 2025
Betronic Group, a Dutch provider of electronics solutions and components, has acquired Irish EMS provider Smart Electronics, the companies announced in a press release

December 17, 2025
Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.

Ewelina-Bednarz_Column-1

December 17, 2025
During this year’s Evertiq Expo in Kraków, the topic of defense electronics filled the conference room to capacity. The top list of defense companies I presented turned out to be only a starting point for conversations that continued long after the session had ended. Behind each of these manufacturers stand dozens of electronics suppliers: semiconductor producers, PCB and RF module manufacturers, and specialized EMS companies. So I asked myself a simple question: which defense technologies drove electronics demand most strongly in 2025? Let’s look at them from the industry’s point of view rather than from a catalogue of weapon systems.

Airbus_contract

December 17, 2025
Headquartered in Karnataka, Rangsons specialises in addressing critical aerospace and defence system requirements through a diversified product portfolio with a fully integrated ecosystem of design, manufacturing, special processes, testing and qualification.

December 16, 2025
Qualcomm Technologies, Inc. has acquired Ventana Micro Systems Inc., a move aimed at strengthening the company’s capabilities in RISC-V CPU development and advancing its custom Oryon CPU technology.

Manufacturing-Plant-Coahuila-Mexico

December 16, 2025
Littelfuse has completed its previously announced acquisition of Basler Electric Company, strengthening the company’s high-power application capabilities.

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