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EPIC-Semiconductor-Centre

March 10, 2026
Applied Materials and Micron Technology are teaming up to develop next-generation memory technologies for AI systems. The work will take place at Applied Materials’ EPIC Center in Silicon Valley and Micron’s research facility in Boise, Idaho.

AiRob-Piotr-Owczarek_2_1

March 10, 2026
High-mix, low-volume production has long been one of the most complex operational environments in the EMS industry. Short production runs, high product variability, frequent changeovers and constant time pressure mean that factories operate in a state of near-constant adaptation. At the same time, customer expectations for quality and flexibility continue to rise, while the availability of skilled labour remains limited. In such conditions, manufacturing ceases to be a collection of independent processes — it becomes a system in which every change carries wider operational consequences.

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SASMOS_MoU

March 10, 2026
This partnership focuses on co-development and co-indigenisation in key technology domains, including fibre optics and photonics; tank electronics; and naval systems and airborne platforms.

PCB-Bo-Lybaek-2020

March 09, 2026
Danish EMS provider GPV reported improved profitability and significantly stronger cash flow in 2025, despite a modest decline in revenue as market demand normalised.

quantum-computer_geralt

March 09, 2026
By integrating NuCrypt’s suite of quantum communications systems and products, QCi expects to advance its technology roadmap while extending its portfolio of quantum communications and quantum photonics solutions.

March 09, 2026
Qualcomm Technologies will manufacture Qualcomm Automotive Module products in India at Tata Electronics’ upcoming semiconductor assembly and test (OSAT) facility in Jagiroad, Assam.

battery_automation

March 06, 2026
The battery manufacturing automation platform is designed to optimize operations by improving cell yields and expediting facility startups for battery manufacturers at any scale.

March 05, 2026
Japanese electronics company TDK has established a new Asia-Pacific regional headquarters (APAC RHQ) in Bengaluru, India, effective 1 April 2026. The move marks the company’s fifth regional headquarters, alongside Japan, Europe, the Americas and China.

Amberg-expansion-render

March 05, 2026
Siemens plans to invest more than EUR 200 million to build a new digitalised and automated factory at its manufacturing and development site in Amberg, Germany. The facility is intended to support the company’s Smart Infrastructure business and is scheduled to be completed by 2030.

businessman-hand-touching-virtual-screen

March 05, 2026
Semtech Corporation, a provider of high-performance semiconductor, IoT systems and cloud connectivity service solutions, has acquired HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data centre interconnects (DCI) and intra-data centre interconnects.

new-technologies_1

March 05, 2026
A significant portion of the investment will focus on new businesses based on these technologies, contributing to the development of South Korea’s future industrial competitiveness.

team

March 05, 2026
The funds will be used for product research and development focused on next-generation electronic warfare and communication payloads across platforms, including drones, ground systems, naval vessels and satellites.

March 04, 2026
EMS provider Neways Electronics has signed a long-term partnership agreement with Thales covering the supply of electronics for advanced radar and sensing systems. The agreement has an initial term of 10 years, according to a press release.

Flagship-Building-Yokohama-Technology-Campus

March 04, 2026
The global NAND Flash market extended its recovery in the fourth quarter of 2025, supported by accelerating AI infrastructure deployments, according to new figures from TrendForce. Combined revenue for the top five NAND Flash suppliers rose 23.8% QoQ to USD 21.17 billion in 4Q25.

PCB-India_3

March 04, 2026
The Indian company will accelerate commercialisation of its machine learning-enhanced analog signal chain chip portfolio, including advanced data converters and intelligent power and sensing solutions for industrial, smart energy, motor control and avionics applications.

windmills-pexels

March 04, 2026
Hitachi will provide project development support for KS Energy’s development of the project and jointly promote the development and operation of this BESS.

logo_on_building

March 04, 2026
The project adds 8,000 km of new fiber routes. This expansion is expected to reach a total of 26,000 km across 23 Brazilian states by the end of 2026. Eletronet is investing USD 30.4 million in this initiative.

Fehring-plant

March 03, 2026
Austrian IC substrates and PCB manufacturer AT&S will invest more than EUR 30 million in its Fehring plant by March 2027. The programme covers new production technologies, sustainability measures and the creation of around 50 jobs.

axonite_chip

March 02, 2026
By reducing radio power consumption and thermal management requirements while meeting spectral emissions targets with margin, Sierra enables a smaller and lighter radio design that simplifies installation and lowers total cost of ownership.

March 02, 2026
Following last year’s validation milestone, both companies will introduce the successful results of multi-cell testing conducted at Samsung’s R&D Lab, enabling scalable deployments and greater processor flexibility within software-based network environments.

GEK_engine

March 02, 2026
The GEK1500 is a 1,500-lb thrust jet engine that could potentially power unmanned aerial systems (UAS), collaborative combat aircraft (CCAs) and missiles.

Kevin-OBuckley-EVP-Global-Operations-Supply-Chain

February 27, 2026
Qualcomm Incorporated has appointed Kevin O’Buckley as executive vice president of Global Operations and Supply Chain, effective 2 March 2026.

February 26, 2026
SK hynix and Sandisk have announced the start of a global standardisation initiative for next-generation memory solution, High Bandwidth Flash (HBF) aimed at the AI inference era.

product

February 24, 2026
SEALSQ Corp and its parent WISeKey International Holding, are planning to move their Geneva headquarters to the Pont-Rouge district in August 2026. The relocation coincides with the launch of the Geneva Quantum Centre of Excellence, intended to consolidate the group’s research and industrial deployment of quantum computing, post-quantum cybersecurity, and secure semiconductor technologies.

di_Piave-2025

February 24, 2026
RECOM Power and Bürklin Elektronik are expanding their long-standing distribution partnership, with a focus on product availability, technical expertise and streamlined delivery processes.

automotive-lighting-plant-india

February 24, 2026
Motherson has inaugurated a manufacturing facility in Sanand, Gujarat, India, established as a strategic joint venture with Marelli. The plant is dedicated exclusively to producing exterior automotive lighting systems and expands the group’s capabilities in automotive component manufacturing.

production-2026

February 23, 2026
DATA MODUL is expanding its industrial product assembly services, offering end-to-end manufacturing solutions designed to increase flexibility, quality, and planning reliability, the company states in a press release.

Hungary-2026

February 23, 2026
German sensor manufacturer SICK has inaugurated a capacity expansion at its site in Kunsziget, Hungary, following a EUR 30 million investment that has created more than 300 new jobs.

February 23, 2026
Denmark-based power cable manufacturer NKT has renewed its long-term copper supply agreement with Polish mining and smelting group KGHM Polska Miedź, securing European-produced copper for the period 2028–2036 in a deal valued at an estimated EUR 6 billion.

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nasdaq-sign

February 20, 2026
Western Digital plans to sell part of its stake in flash memory unit Sandisk for USD 3.17 billion as the company seeks to cut debt, Reuters reports.

sign-on-building

February 20, 2026
US semiconductor company Qualcomm says it plans to invest up to USD 150 million in India’s technology and AI startup ecosystem through a new strategic venture fund.

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