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IIT_Hyderabad_MOU

June 25, 2026
As part of this collaboration, the Centre for Development of Telematics (C-DOT) is establishing a Centre of Excellence (CoE) at IIT Hyderabad to accelerate research, innovation and capacity building in advanced communication domains in India.

June 24, 2026
Nokia and Lenovo have signed a multi-year, multi-technology patent cross-license agreement. The terms are confidential. The two companies previously signed a similar agreement in 2021.

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Munich-facility

June 24, 2026
The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.

machine

June 24, 2026
Rotterdam-based semiconductor metrology company Nearfield Instruments has closed a USD 380 million Series D funding round, valuing the company at USD 1.6 billion. The round is the largest deep-tech funding round ever completed in the Netherlands.

quantum-technologies-1

June 24, 2026
By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.

June 22, 2026
The joint program includes a multi-year plan focused on solid-state battery development and associated manufacturing processes. The agreement follows Honda’s successful completion of a technology evaluation agreement with QuantumScape Corporation (QS).

Announcement-of-the-Top-List

June 18, 2026
With 31 companies in the global EMS/ODM Top 100, Europe has breadth – but not scale. A look at the region's top 20 reveals a manufacturing base spread across 14 countries, led by Germany and with the Nordics punching well above their weight.

MIMCAP_silicon_interposer

June 18, 2026
By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.

LG_Uplus_MoU

June 18, 2026
Under the partnership, Samsung Research will develop core Integrated Sensing and Communication (ISAC) and AI-driven 6G technologies while LG Uplus will lead validation including data provision and field-testing infrastructure setup.

Computing

June 17, 2026
The US-based company plans to accelerate the development and deployment of commercial-scale fault-tolerant quantum computers. Atom Computing recently announced a full demonstration of quantum error correction on its quantum computers.

axonite_chip

June 17, 2026
The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

Announcement-of-the-Top-List

June 16, 2026
Europe has long been regarded as a manufacturing powerhouse. Yet in electronics manufacturing services (EMS), the continent faces an increasingly difficult challenge: keeping pace with competitors in Asia.

Borje-Ekholm-CEO

June 16, 2026
Ericsson has announced that Börje Ekholm is stepping down as President and CEO, with Per Narvinger appointed as his successor. Narvinger, currently Executive Vice President and Head of Business Area Networks, takes over on October 1, 2026.

Malaysia_facility

June 12, 2026
The Penang facility spans 60,000 square feet and houses 12 production lines, providing a monthly production capacity of upto 300,000 units. It operates as an OEM manufacturing base for industrial electronics, environmental control and electronics power modules.

data_center

June 12, 2026
The partners will use the platform to conduct research on the application of near-term quantum and hybrid quantum-classical computing including areas such as portfolio optimization and expanding explorations around quantum machine learning.

Romania-opening-2026

June 10, 2026
German fan and motor manufacturer ebm-papst has officially opened a new facility in Oradea, Romania, following an investment of approximately EUR 30 million. The site brings together production, research and development, and service functions under one roof.

opens-expanded-facility-Tajecina-Poland

June 10, 2026
RTX subsidiary Collins Aerospace has opened an expanded manufacturing facility in Tajęcina, Poland, following a USD 69 million investment. The 22,000 square-metre site will increase landing gear system production capacity by nearly 25% for both commercial and defence aircraft programmes.

India_quantum_centre

June 09, 2026
The centre will bring together Deloitte’s global quantum network, IIT-B’s academic excellence, start-ups, technology partners and industry innovators to help Indian enterprises de-risk quantum investments, develop use cases, build talent and transition to real-world deployment.

PCB-Japan_2

June 09, 2026
As a result of this latest capital increase by Japan’s Information-Technology Promotion Agency (IPA), Rapidus’ funding now totals 424.95 billion yen (about USD 2.7 billion).

Samueli_semiconductor_hub

June 08, 2026
The mission of the semiconductor hub is to foster sustained collaboration between leading faculty and industry partners Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys to drive advances in connectivity, computing and intelligent systems.

fiber_network_thedigitalartist

June 08, 2026
The partnership represents an effort to extend the technologies developed under NTT’s Innovative Optical and Wireless Network (IOWN) into the space domain and accelerating the realization of the IOWN vision.

June 02, 2026
French computing company Bull and Foxconn have announced a strategic partnership to manufacture AI and cloud infrastructure in Europe. The collaboration combines Bull's AI systems design and go-to-market capabilities with Foxconn's manufacturing scale, with an initial investment exceeding EUR 120 million.

June 01, 2026
Eigen’s inference and post-training optimization layers will be integrated directly into Nebius Token Factory, which provides enterprise-grade autoscaling endpoints and fine-tuning pipelines across all major open-source models.

Future

June 01, 2026
The California-based global Embodied AI (EAI) ecosystem company is focusing on two product engines: Embodied AI (EAI) humanoid and bionic robots, and EAI automotive robots.

Quantum_Wafer

May 27, 2026
The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.

li-battery_2

May 21, 2026
The call, jointly funded by the EU’s Horizon Europe program and India’s Ministry of Heavy Industries, will support the development of recycling technologies, including high-efficiency material recovery, safe and digitalised collection systems, and pilot-scale demonstration of innovative processes.

quantum-technologies-1

May 19, 2026
Saudi energy giant Aramco and French company Pasqal also unveiled the first commercial Quantum Computing as a Service (QCaaS) platform in the Middle East. QCaaS enables remote cloud access for potential clients around the globe.

India_network

May 19, 2026
Solidifying this network, the South Korean company has formalized agreements with four new partner institutions: IIT Kanpur, IIT Hyderabad, Visvesvaraya National Institute of Technology (VNIT) Nagpur and Tezpur University.

PCB-India_1

May 18, 2026
The collaboration between the two companies will focus on deploying ASML’s holistic suite of advanced lithography tools and solutions for Tata Electronics’ upcoming 300 mm (12 inch) semiconductor fab in Dholera, Gujarat.

leadership

May 15, 2026
The new capital will be used to build scalable production capacity, expand cloud-based access to eleQtron’s systems, and further develop its hardware platform. The company is also advancing its proprietary MAGIC technology.

Open-German-RD-Centre

May 12, 2026
Taiwanese power electronics manufacturer Delta has officially opened a new R&D centre in Soest, Germany, expanding its European innovation capacity with a focus on high-efficiency power solutions for AI data centres and electric mobility.

Gunter-HTV-Alter-Interview

May 12, 2026
As semiconductor lifecycles increasingly mirror consumer electronics timelines, the pressure on manufacturers in long-life industries to manage component obsolescence is intensifying. Gunter Mößinger of HTV ALTER TECHNOLOGY addressed the issue head-on at Evertiq Expo Tampere – and the picture he painted is one the industry can no longer afford to ignore.

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