Evertiq - First In Electronics News & Expo

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PCB-India_1

April 27, 2026
Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.

F124_engine

April 27, 2026
By adding engine manufacturing in Phoenix, Honeywell will now be able to co-locate production of the F124 on site alongside the existing engineering and design center in support of the US Navy Undergraduate Jet Training System (UJTS) program.

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Hanwha_MOU

April 27, 2026
The partnership brings together Hanwha’s expertise in propulsion, energy storage and systems integration with Rina’s regulatory and certification know-how, fostering the development and adoption of next-generation propulsion solutions for the maritime sector.

Neura

April 27, 2026
By running the Neuraverse on Amazon Web Services (AWS) and connecting Neura Gym to AWS services, Neura Robotics can accelerate how robotic intelligence is trained, tested, and continuously improved across customer, partner and internal use cases.

Sponsored content by Shanghai Yongming Electronic Co.,Ltd

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YMIN's SLR hybrid supercapacitors enable reliable energy storage at -40°C, with stable capacitance, low ESR, and long service life. Ideal for IoT, smart meters, and outdoor use in extreme climates.

SOCAMM2

April 24, 2026
SOCAMM2 is a module that adapts low-power memory — which was previously used mainly in mobile products like smartphones — for server environments. It is designed to be a primary memory solution for next-generation AI servers.

Top-30

April 23, 2026
The global EMS/ODM industry continues to expand, but scale and growth remain unevenly distributed, with Asian players flexing their dominance while Europe lags behind, according to new research from in4ma and EMSNOW.

Newen

April 23, 2026
The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.

SDI_Mercedes_Benz

April 23, 2026
Under the agreement, Samsung SDI will supply high-performance batteries for Mercedes-Benz’s next-generation electric vehicles. Mercedes-Benz plans to use the batteries in future compact and mid-size electric SUVs and coupe models.

Microsystems

April 23, 2026
This strategic investment will accelerate Spark’s expansion and commercialization momentum for LE-UWB technology as customer demand surges for wireless solutions capable of meeting the performance and power requirements of intelligent edge devices.

April 22, 2026
The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.

quantum-technologies-1

April 22, 2026
Sygaldry servers are designed to address constraints in AI training and inference by operating alongside classical infrastructure within the data center. The company is also developing quantum algorithms that plug into the tools AI researchers already use.

InductEV

April 22, 2026
The acquisition secures a robust supply chain that balances Israeli company Electreon’s offshore manufacturing efficiencies with InductEV’s Build America Buy America (BABA) compliant offerings.

Dominik-Kowalczyk

April 21, 2026
In many projects, electromagnetic compatibility (EMC) is still treated as a final-stage verification step. In practice, this approach increasingly leads to delays, costly redesigns and errors that are difficult to eliminate — particularly in complex defence systems. As Dominik Kowalczyk, an explosion protection specialist at Dacpol, told Evertiq, EMC analysis should cover the entire lifecycle of a project — from concept to deployment. He also pointed out where signal integrity is most often lost and why the traditional approach to EMC is no longer keeping pace with growing system complexity.

Electronics_REF_ARIF240GaN

April 21, 2026
REF_ARIF240GaN is specifically designed to support the launch of EZ-PD PMG1-B2, Infineon’s newest USB PD 3.2 controller, featuring up to 240W USB sink capability and integrated buck-boost functionality in a compact single package.

Aerospace_F404

April 21, 2026
The depot facility for F404 -IN20 engines will be owned, operated and maintained by Indian Air Force (IAF) with GE Aerospace providing technical inputs, training, support staff and supply of necessary spares and specialized equipment.

CircleK_partnership

April 20, 2026
The collaboration is centered around a strategic ambition to expand to more than 350 sites featuring Rechargeries @ Circle K, combining Ionna’s charging technology and driver-first experience with Circle K’s nationwide footprint.

turbocharger

April 17, 2026
BorgWarner’s VTG turbocharger technology enables precise control of engine operation, optimizing performance across a broad range of engine speeds and integrating advanced combustion strategies to boost efficiency, enhance fuel economy and lower emissions.

3090-ti

April 17, 2026
We often speak about the performance of modern GPUs in abstract terms — trillions of operations, ever-increasing compute power. What remains less visible is the structure that makes it possible.

Kawasaki-main-office

April 17, 2026
Under this agreement, Fujitsu will leverage Chugoku’s intellectual property to launch an advanced power grid operation and maintenance support service for power transmission and distribution companies.

Electric_BESS

April 17, 2026
Located in Zhangye City, the project is equipped with Sineng Electric’s 1,250 kW central Power Conversion System (PCS), which ensures optimized performance across a wide operating voltage range while minimizing conversion losses.

server-hall

April 15, 2026
Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.

motherboard-Switzerland

April 15, 2026
On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.

Data-center

April 15, 2026
Swedish Sivers Semiconductors has entered a collaboration with Jabil, one of the world’s largest EMS providers, to develop an energy-efficient 1.6T pluggable optical transceiver module targeting AI data centres.

atimedia_solar

April 15, 2026
GAIL will develop a 600 MW solar power project along with a 550 MWh BESS in Uttar Pradesh, and a 100 MW solar power project with a 22 MWh BESS in Maharashtra, with a total investment of over USD 400 million.

April 15, 2026
The transaction will be executed through a company split whereby the business will be transferred to the successor company, followed by the transfer of all issued shares of the successor company to the acquirer.

M12

April 14, 2026
M12 Series HDDs leverage Toshiba’s proprietary design and analysis technologies cultivated through the development of slimmer and more compact components. The new M12 is the first glass substrate nearline HDD for Toshiba.

engineer-holding-chip

April 13, 2026
Market research firm Gartner forecasts that global semiconductor revenue will exceed USD 1.3 trillion in 2026, representing 64% growth – the strongest growth in more than two decades – driven by continued strong demand related to AI, data centers and rising memory prices.

data_centers

April 13, 2026
This financing will enable the California-based semiconductor company to accelerate the development of its next generation data center solutions and expand its global engineering teams to meet the needs of agentic AI workloads.

UgoWork_batteries

April 13, 2026
This approval allows Linde customers to integrate UgoWork’s UL-listed energy solutions alongside KION’s existing battery offering, giving its customers flexibility in choosing the forklift power system.

PCB-India_1

April 10, 2026
Cyient Semiconductors’ global reach enables Kinetic Technologies to tap into India’s semiconductor ecosystem, gaining access to engineering talent, OSAT and manufacturing partners, and stronger design capabilities.

Decker_headquarters

April 10, 2026
Stanley Black & Decker expects to utilize the net proceeds from the sale of its Consolidated Aerospace Manufacturing (CAM) business Howmet Aerospace to reduce debt.

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