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FAMES

February 03, 2026
The FAMES pilot line has been officially inaugurated at CEA-Leti’s site in Grenoble, France, following the delivery of its first validated technical results. The inauguration marks the opening of a new cleanroom facility dedicated to advanced semiconductor technologies and based on 300mm semiconductor equipment.

February 02, 2026
Vanguard International Semiconductor Corporation (VIS) has signed a technology licensing agreement with TSMC covering both low-voltage (80V) and high-voltage (650V) gallium nitride (GaN) process technologies.

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project

January 30, 2026
In the UK, Metlen secured a new EPC contract with Elgin for the 24.5 MW Maesmawr solar park. In Ireland, Metlen signed a new EPC contract for a solar project in County Louth. In Italy, it signed a 7-year physical Tolling Agreement for a 25MW BESS in Apulia region.

Marco-Peter-2026

January 29, 2026
When German memory company Neumonda talks about bringing semiconductor memory manufacturing back to Germany, it sparks curiosity — not about the technology itself, but about the scale, the investment needed, and whether it’s actually possible.

supercomputer_Athena

January 29, 2026
Housed in the Modular Supercomputing Facility at NASA’s Ames Research Center in California, Athena delivers more computing power than any other NASA system, surpassing the capabilities of its predecessors, Aitken and Pleiades, in power and efficiency.

new-technologies_5

January 28, 2026
For years, the global technology narrative seemed simple: the United States led in innovation, while China was primarily seen as the world’s manufacturing floor. But that picture has been changing rapidly, almost in real time. As competition between Washington and Beijing increasingly centres on technology and strategic industries, a key question emerges: do the numbers actually reflect this shift? Has China truly caught up with — or even overtaken — the United States in research and development spending? And how does the broader global ranking look beyond this high-profile rivalry?

windmills-pexels

January 27, 2026
The funding will enable terralayr to further grow its grid-scale battery storage portfolio in Germany, while scaling the company’s LAYR flexibility-as-a-service platform.

L-Charge

January 26, 2026
The investment will support rapid growth in installations in the rideshare, last mile delivery, fleet segments and the expansion of US company L-Charge’s service and sales teams.

PCB-India_2

January 26, 2026
Under the partnership, Infineon will collaborate with NIELIT — an autonomous body under India’s Ministry of Electronics and Information Technology (MeitY) — to develop training programs in semiconductor assembly, test and packaging.

solar_project_Uzbekistan

January 23, 2026
Masdar will design, build and operate the 300 MW solar power plant and 75 MWh BESS under the terms of the Public-Private Partnership agreement it signed with JSC National Electric Grid of Uzbekistan.

building

January 23, 2026
The Georgia facility is designed for 2 GWh of initial annual production capacity, scalable to up to 8 GWh, and is expected to begin mass production in mid-2026.

Ewelina-Bednarz_rare-earth-minerals_1

January 22, 2026
In the first weeks of 2026, Venezuela returned to the headlines not because it suddenly became stable, but because Washington once again began to play the country — politically and economically. On the US side, there were signals of intensified efforts aimed at shifting the balance of power in Caracas. In practice, this points to a “reset” scenario: Venezuela re-entering the investment conversation under a new framework. But setting politics aside for a moment, what could this actually mean for the electronics industry? Is Venezuela truly an Eldorado?

Energy_BESS

January 22, 2026
The first BESS, at a cost of USD 100 million, was completed ahead of schedule, serving customers in North Carolina and South Carolina, beginning in November. Final testing is being completed this month. Construction of a second BESS will begin in May.

January 21, 2026
Electronics manufacturer Jabil has made a strategic minority investment in US-based Eagle Harbor Technologies, operating under the name EHT Semi, and entered into a manufacturing collaboration focused on RF and pulsed-power systems for advanced semiconductor manufacturing.

Bearings_Ahamani

January 21, 2026
By combining Ahamani’s advanced drone platforms, power systems and control technologies with NBC’s precision engineering expertise and manufacturing scale, the partnership aims to address rapidly growing demand across all drone applications.

opens-new-site-in-Malaysia

January 20, 2026
US-based AI semiconductor company Syntiant has opened a new manufacturing and research facility in Penang, Malaysia.

January 20, 2026
Jabil has acquired Hanley Energy Group, a specialist in energy management and critical power solutions for data centers.

SDI_KGM

January 19, 2026
As part of the agreement, the companies will focus on battery pack technologies using Samsung SDI’s 46-series cylindrical battery cells, while expanding collaboration on technologies to advance next-generation battery pack development.

quantum-technologies-1

January 19, 2026
Current quantum computers demand huge investment: custom fabrication, exotic cooling, specialist teams. Equal1 delivers a different model: quantum servers where cost, ease of deployment, power efficiency, and integration are first-order requirements.

COO-Marco-Mezger-column-portrait

January 16, 2026
The memory super cycle is no longer a forecast - it is a reality. Across all major financial institutions and industry media, we see the same message. 2026 will be defined by structural undersupply, especially in DRAM and NAND. Here’s what we are seeing.

businessman-hand-touching-virtual-screen

January 15, 2026
Teledyne Technologies has acquired DD-Scientific Holdings Limited and its subsidiary DD-Scientific Limited.

January 15, 2026
This endeavor fast-tracks the deployment of intelligent motion sensing into smart home devices, opening the door for powerful new services across home automation, security and energy management.

Aerospace_GEnx

January 15, 2026
Engineered with advanced materials and cutting-edge technologies, the GEnx engine family boosts modern propulsion with higher time-on-wing and reliability. Since its introduction in 2011, the GEnx family powers two-thirds of all Boeing 787 aircraft in operation.

Wave_product

January 14, 2026
The acquisition will bring together D-Wave’s expertise in scalable control of superconducting processors as well as its production-grade, high-availability quantum cloud platform with Quantum Circuits’ leading approach to error-corrected superconducting gate-model technology.

PCB-USA_2

January 12, 2026
The program at the Texas State Technical College (TSTC) will include a wafer processing learning facility with a mock cleanroom replicating industry workflows.

hynix_DDR5_RDIMM

January 09, 2026
As an Intel Data Center Certified system/platform, 256GB DDR5 RDIMM has completed extensive testing and rigorous validation by Intel’s Advanced Data Center Development Laboratory.

quantum_computer

January 09, 2026
The deployment will expand the Galician Supercomputing Center’s (CESGA) advanced computing capabilities and strengthen its role as a key national and European research infrastructure.

worker-holding-board

January 07, 2026
PCB supplier NCAB has appointed Kelly Davidson as president of NCAB North America. Davidson previously served as vice president of the company’s North American operations.

Battery_Alexandra_Koch

January 07, 2026
The project is to be executed within 18 months from the date of signing the Battery Energy Storage Purchase Agreement (BESPA) and regulatory approvals.

Team

January 05, 2026
The funding has enabled the Swiss-American deeptech startup to develop and demonstrate its multi-color laser technology, which connects computing chips (GPUs, TPUs) in AI clusters faster and more efficiently than copper cables can.

chip

January 02, 2026
onsemi will pair its silicon drivers, controllers and thermally enhanced packages with GlobalFoundries’ 650V GaN technology platform to deliver optimized gallium nitride (GaN) devices with higher power density and efficiency.

Toshiba_EDA

January 02, 2026
Toshiba’s deployment of Siemens’ EDA tools includes advanced thermal design and analysis for 3D IC architectures; power optimization, integrity and reliability enhancement; and next-generation analog simulation acceleration.

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