Evertiq - First In Electronics News & Expo

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John-Ternus-Tim-Cook

April 21, 2026
Apple CEO Tim Cook will step down from his role on September 1, 2026, with John Ternus appointed as his successor.

Dominik-Kowalczyk

April 21, 2026
In many projects, electromagnetic compatibility (EMC) is still treated as a final-stage verification step. In practice, this approach increasingly leads to delays, costly redesigns and errors that are difficult to eliminate — particularly in complex defence systems. As Dominik Kowalczyk, an explosion protection specialist at Dacpol, told Evertiq, EMC analysis should cover the entire lifecycle of a project — from concept to deployment. He also pointed out where signal integrity is most often lost and why the traditional approach to EMC is no longer keeping pace with growing system complexity.

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Mechelen-manufacturing-site

April 21, 2026
Aumovio plans to divest its manufacturing site in Mechelen, Belgium, to Dumarey Group, as part of efforts to optimise its production footprint.

Poing-Germany

April 21, 2026
Avnet plans to close its logistics centre in Poing by the end of 2026, affecting around 350 employees, according to reporting by Handelsblatt and Merkur.de.

partnership_Franz26

April 20, 2026
Seal Dynamics’ presence in Asia and Brazil will connect aerospace OEMs with Greene Tweed’s high-performance solutions, including advanced sealing systems and Xycomp DLF thermoplastic composites, that address their specific challenges.

Robotics

April 20, 2026
The capital will be used to enhance the product portfolio and boost commercial development. Over 50 units of ALEX RS, a device for neuromotor rehabilitation of the upper limb, have already been installed internationally.

Airlogix_JV

April 17, 2026
The contract covers mid-range X-wing and delta-wing unmanned aerial systems manufactured in Germany for the Armed Forces of Ukraine. This is the largest German production order for heavy autonomous strike drones to date.

quantum-technologies-1

April 17, 2026
This brings the company’s total funding to more than EUR 5 million. The funds will be used to further develop the technology and to establish a European pilot production facility for superconducting quantum processors.

top-image-generic

April 16, 2026
The European Commission has unveiled a new EUR 115 million funding instrument aimed at accelerating the development and deployment of disruptive defence technologies, with a strong focus on SMEs, start-ups and scale-ups across the EU.

Sowa-interview-2025-krk

April 16, 2026
Through-hole technology (THT) has never disappeared from electronics manufacturing. But the way it is handled continues to shift — shaped less by the process itself and more by the conditions around it.

server-hall

April 15, 2026
Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.

motherboard-Switzerland

April 15, 2026
On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.

Data-center

April 15, 2026
Swedish Sivers Semiconductors has entered a collaboration with Jabil, one of the world’s largest EMS providers, to develop an energy-efficient 1.6T pluggable optical transceiver module targeting AI data centres.

Claude-Loeffen

April 15, 2026
Europe is investing heavily in semiconductors. New fabs are being planned, public funding is flowing, Chips Act 2.0 is on its way and long-term initiatives are taking shape. But there’s a more basic question that doesn’t seem to get asked enough: Even if all of this gets built, who is going to run it?

3D-Nand

April 14, 2026
Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.

boundry-switzerland

April 14, 2026
Swiss EMS provider Cicor reported solid order intake in the first quarter of 2026, supported by continued strength in the Aerospace & Defence (A&D) segment and new customer wins.

engineer-holding-chip

April 13, 2026
Market research firm Gartner forecasts that global semiconductor revenue will exceed USD 1.3 trillion in 2026, representing 64% growth – the strongest growth in more than two decades – driven by continued strong demand related to AI, data centers and rising memory prices.

Basquevolt

April 13, 2026
The Joint Development Agreement (JDA) aims to fast-track lithium metal-based battery technology for Pre-A Sample EV requirements.

April 13, 2026
The joint venture will focus on the development of ceramic materials primarily for MLCCs, other electronic component materials, and their manufacturing processes.

Robots

April 10, 2026
By bringing together Agile Robots’ hardware and other AI robotic solutions developed with Google DeepMind’s Gemini Robotics foundation models, the two teams will improve performance via robot deployment, data collection, model training and iteration.

windmills-pexels

April 10, 2026
The acquisition will create an integrated model that accelerates US company FlexGen’s project delivery, enhances system performance, and strengthens long-term asset reliability for customers.

EUV-system

April 09, 2026
Worldwide sales of semiconductor manufacturing equipment increased 15% to USD 135.1 billion in 2025 from USD 117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, according to SEMI.

Gigafacotry

April 09, 2026
Norwegian battery manufacturer Morrow Batteries has initiated deliveries of lithium iron phosphate (LFP) battery cells to Finnish technology company Proventia, marking a step forward in the company’s industrialisation efforts at its Arendal facility.

interview-Piotr-Owczarek-AIRob

April 09, 2026
During Evertiq Expo Tampere 2026, modular robotics and pragmatic automation took centre stage as Piotr Owczarek, Executive Leader in Industrial Operations & AI Innovation at Fitech and AIRob, outlined how manufacturers can better navigate the complexities of high-mix, low-volume (HMLV) production.

rgb-dram

April 08, 2026
Tightening supply conditions and ongoing product transitions are driving a sharp increase in consumer DRAM prices, according to new data from TrendForce.

Sevnce_Robotics

April 08, 2026
The two companies will explore potential applications of Sevnce’s robotic and intelligent inspection solutions at BASF sites, and advance materials innovation for key robotic components.

headoffice

April 07, 2026
Japanese component manufacturer Murata has completed a new production building at its subsidiary Izumo Murata Manufacturing Co., Ltd. in Izumo, strengthening its capacity for multilayer ceramic capacitors (MLCCs).

April 07, 2026
SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.

geralt_AI

April 07, 2026
The investment from TA will support iBase-t’s product innovation and expansion as aerospace and defense manufacturers scale production, modernize sustainment operations, and accelerate adoption of AI-enabled digital manufacturing technologies.

AI_infrastructure

April 06, 2026
With USD 650 million raised in the past six months, the South Korean AI chip startup is entering a new phase of growth focused on US market expansion, scaled production of its Rebel100 platform, and preparation for a future IPO.

Fairchild_CEO_SiemensUSA

April 03, 2026
Fairchild has been with Siemens for more than 25 years, most recently serving as general counsel for Siemens USA, overseeing legal, compliance, regulatory and intellectual property functions.

funds_PabitraKaity

April 03, 2026
Headquartered in San Diego, GALT Aerospace is a provider of C3 solutions with core capabilities across airborne networking, multi-domain communications, radio/waveform integration, rapid prototyping, and systems engineering.

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