ASMPT secures orders for more than 50 chip-to-substrate bonding tools
ASMPT announced in late July bulk orders for more than 50 of its Chip-to-Substrate Thermo-Compression Bonding tools from OSAT customers, for use in advanced AI computing chip packaging.
The company describes the win as confirmation of its position as the primary supplier and process of record for C2S TCB applications.
The orders cover ASMPT's C2S TCB tools, which enable bonding of larger compound dies – a capability increasingly important as AI and high-performance computing applications drive demand for more advanced packaging architectures, according to a press release from the company.
ASMPT estimates the total addressable market for TCB tools will expand beyond USD 1.6 billion by 2028, driven by growing AI investment and increasing packaging intensity.
"These significant wins underscore the strong trust our customers continue to place in ASMPT as the technology and production partner of choice,” said Robin Ng, Group CEO, ASMPT. “They have confidence in us because we consistently deliver production-proven solutions. Our TCB solution suite spans chip-on-wafer, chip-on-substrate, and HBM applications, and we are the key enabler for the industry’s ambitious advanced packaging roadmaps.”
