Evertiq - First In Electronics News & Expo

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Neue_Klasse

September 21, 2026
The high-performance components integrated into the vehicle support key power electronics functions and are designed to deliver high energy efficiency as well as reliable operation under demanding automotive conditions.

PCB-India_2

September 21, 2026
The two Indian companies will jointly explore chip fabrication and packaging opportunities for L&T Semiconductor’s current and future products across Tata Electronics’ range of fab process technologies and packaging solutions.

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Sponsored content by Koh Young Europe

Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6 to 8, 2026, at Messe Stuttgart. The new industry event will bring together experts, manufacturers, and suppliers to explore innovations, exchange ideas, and build partnerships across the electronics manufacturing process chain.

Expo-GOT2026_001

September 18, 2026
Evertiq Expo brought 908 people from 456 companies to Svenska Mässan in Gothenburg on 17 September. 496 visitors from 307 companies were welcomed by 149 exhibiting companies. The day featured a broad conference programme covering the semiconductor market, component management, circularity and the evolving EMS industry.

quantum-computer_geralt

September 18, 2026
The funding will be deployed across R&D on H-DES, the recruitment of quantum researchers and domain expert engineers, expansion of hardware, academic and industrial partnerships, and international growth to prepare for scale.

Materials_research

September 18, 2026
The investment will be deployed towards deepening R&D in India, expanding the domestic semiconductor supply chain and developing future talent. The US company also plans to establish a 140-acre advanced semiconductor research park in India.

Minnesota-facility

September 18, 2026
Under the agreement, Qolab will serve as a lead customer on SkyWater’s newly launched SC250 superconducting platform to advance its Quantum System-in-Package (QSiP). QSiP architecture is designed to address cost, complexity and form-factor challenges in scaling quantum systems.

India_facility

September 17, 2026
The investments are expected to be made in two phases starting from October 2026, with commercial production starting in the fiscal year 2028.

tool

September 17, 2026
Rather than serving a single point in the water cycle, Gradiant will deliver its full semiconductor portfolio across these sites — from ultrapure water production to high-recovery wastewater treatment, scrubber reclaim, treatment of complex streams and zero liquid discharge.

headquarters

September 16, 2026
The center in Germany will accelerate the development of next-generation process solutions, deepen collaboration with leading semiconductor manufacturers, and further strengthen SUSS’s position in the fast-growing Advanced Packaging market.

Indie

September 15, 2026
The Bengaluru office will serve as a local hub for customer engagement, applications support, training, and strategic partnerships, and will strengthen Teradyne’s ability to support India’s expanding base of chipmakers and electronics manufacturers.

Fortaegis

September 15, 2026
The investment will enable the Dutch company to scale production and commercial deployment of its FPGA products across the United States, Europe, Singapore and Japan and to advance the ASIC roadmap, while growing its engineering and commercial capacity.

Flagship-Building-Yokohama-Technology-Campus

September 15, 2026
The Tokyo-based memory-storage maker has been speaking with lenders such as Bank of America, Goldman Sachs Group and JPMorgan Chase on an offering that could take place in 2027, Bloomberg reports.

September 14, 2026
Under the agreement, Samsung will integrate Mistral’s AI services and solutions — including its flagship large language model, Mistral Large — across its semiconductor operations to develop customized on-premises AI models optimized for intelligence-driven infrastructure.

LG_UWB

September 11, 2026
The collaboration pairs Ceva-Waves UWB baseband IP and software with UWB radio frequency (RF) technology developed by LG's SoC Center, giving customers a silicon-ready platform for integrating UWB into their SoCs. LG's UWB RF supports TSMC's 22nm process.

Belgium_flag

September 10, 2026
A 52-year-old man holding both Belgian and Chinese citizenship has been arrested by Belgian authorities on suspicion of stealing trade secrets related to gallium nitride (GaN) semiconductor technology, according to Reuters. Investigators believe the information he obtained may have been passed to a Chinese company operating in the same industry.

September 10, 2026
GlobalFoundries has finalised a definitive agreement with the US Department of Commerce for a USD 375 million research and development award to advance its Quantum Technology Solutions business. The funding is tied to milestone achievements over a five-year period.

September 10, 2026
German automotive semiconductor manufacturer Elmos Semiconductor and South Korean foundry SK keyfoundry have signed an agreement expanding their collaboration to include 130nm technology, securing long-term wafer capacity through 2037. The two companies have worked together on 350nm technology for 18 years.

CEO-vincent-Roche

September 10, 2026
Analog Devices has announced a definitive agreement to acquire Alif Semiconductor in an all-cash transaction valued at USD 1.35 billion, with potential additional contingent consideration of up to USD 200 million. The deal is expected to close before the end of 2026.

building_logo

September 10, 2026
The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.

SECO-deal

September 09, 2026
German humanoid robotics company NEURA Robotics and Italian embedded computing specialist SECO have announced a strategic partnership to industrialise and scale Physical AI from Europe. SECO will design, engineer and manufacture electronic compute modules for NEURA's cognitive robots, including the humanoid 4NE1, integrating Qualcomm Dragonwing processors.

headquarters

September 09, 2026
The Advanced Semiconductor Lab in Bengaluru provides a unified platform for electrical validation, automated testing, qualification and failure analysis, streamlining the journey from design specifications to finished semiconductor parts.

campus-veldhoven

September 08, 2026
ASML has marked the start of construction of a second major industrial campus in the Brainport region of the Netherlands. The new campus at Brainport Industries Campus North in Eindhoven will eventually span approximately 350,000 square metres and provide potential capacity for up to 20,000 workplaces.

opening-Austin-innovation-center

September 08, 2026
Silicon Labs has opened a new research and development laboratory at its headquarters in Austin, Texas, expanding its capabilities for advanced chip design, testing and validation.

PCBs

September 08, 2026
While the semiconductor supply chain has dominated industry attention in recent years, a parallel bottleneck has been building in PCB base materials. AI data centre expansion is absorbing large quantities of high-grade laminates, leaving less capacity available for traditional industrial and automotive applications, according to a joint market analysis by STARTEAM GLOBAL and Würth Elektronik.

Expo-GOT25-6

September 07, 2026
Evertiq Expo Gothenburg takes place on September 17 and brings together the Swedish and Nordic electronics industry for a full day focused on the semiconductor market, component management, PCB manufacturing and how the global EMS industry is changing.

headquarters

September 07, 2026
Manz Asia contributes inkjet capabilities, manufacturing engineering expertise and a strong position in the panel-level packaging ecosystem. German manufacturer SUSS brings semiconductor process expertise and global customer reach.

building

September 07, 2026
By combining 1Aardvark’s mission software expertise with CesiumAstro’s satellites, communications systems and advanced computing capabilities, the company can now support more capable missions in which spacecraft can respond to changing conditions.

Sponsored content by KOH YOUNG

Koh Young, the industry leader in True 3D measurement-based inspection solutions, will serve as the Premier Sponsor of IPC APEX EXPO 2026, March 16 to 19 at the Anaheim Convention Center. At Booth 1824, Koh Young will demonstrate how AI-powered inspection and software solutions help electronics manufacturers improve stability and productivity amid tighter tolerances, higher mix production, and rising quality expectations.

Semiconductor

September 04, 2026
NanoBridge Semiconductor will provide its customers with a version of Precision FPGA Synthesis tuned for its NBS6503H and NBS1201 FPGA device families, helping designers achieve high-quality synthesis results while supporting efficient implementation workflows.

axonite_chip

September 04, 2026
GCT Semiconductor and the infrastructure provider for utilities and IoT have a long history of cooperation in the utility sector. The collaboration combines GCT’s cellular and NTN expertise with the provider’s industrial-grade wireless innovation.

Photonics-production

September 03, 2026
Swedish company Sivers Semiconductors is investing USD 30 million to expand its indium phosphide manufacturing facility in Glasgow, Scotland.

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