n-hop, OneAsia partner on data transfer, network solutions
By leveraging the BATS technology, the two companies intend to develop robust solutions that boost data flow efficiency and responsiveness.
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Samsung awarded $4.8B to boost US chip production
The US Department of Commerce has awarded Samsung Electronics up to USD 4.745 billion in direct funding under the CHIPS Incentives Program, supporting the company’s USD 37 billion expansion of advanced semiconductor manufacturing in Central Texas.
Volkswagen invests $48 million for 9.9% stake in Patriot Battery Metals
Patriot also signed a supply agreement with Volkswagen’s battery manufacturer, PowerCo, under which it is expected to supply 100,000 tonnes of spodumene concentrate annually for 10 years.
Texas Instruments secures $1.6 billion in CHIPS Act funding
The US Department of Commerce says it will grant Texas Instruments (TI) up to USD 1.61 billion in direct funding under the CHIPS Incentives Program.
Hong Kong’s Trio AI partners with HKT in AISC solution
The agreement between Trio and HKT establishes a collaborative framework to explore opportunities to resell, market and promote the AISC solution in Hong Kong, the Greater Bay Area and Southeast Asia.
Polish innovator secures major OLED partnership in China
Polish innovative company Noctiluca has signed another major deal in China. This time a Joint Development Project (JDP) agreement with one of the key OLED companies. The Polish technology company did not reveal who exactly it is about. All that is known is that the JDP was signed with a subsidiary of the world's second-largest TV manufacturer for the development of OLED printed technology. The cooperation concerns the implementation of Noctiluca's proprietary chemical compound into the Chinese giant's commercial products.
Poles are revolutionizing the immediate translation market
Polish company Vasco Electronics has launched a high-tech product in the immediate translation category. Vasco Translator E1 allows translation and conversation in multiple languages simultaneously. The headphones, along with the application w support up to 64 languages.
EU approves €1.3B support for Italian semiconductor plant
The European Commission has approved EUR 1.3 billion in Italian state aid to support Silicon Box in building an advanced semiconductor packaging and testing facility in Novara.
SignOff Semi opens new office in Penang, Malaysia
Indian provider of VLSI and Embedded Design services, SignOff Semiconductors, expands with the opening of its new office in Penang, Malaysia.
Rapidus installs Japan's first AMSL EUV lithography machine
Japanese semiconductor manufacturer, Rapidus, has reached a milestone by installing Japan's first Extreme Ultraviolet (EUV) lithography machine from ASML. This advanced technology is now part of Rapidus' Innovative Integration for Manufacturing (IIM-1) foundry, an advanced semiconductor fab under construction in Chitose, Hokkaido.
NXP to acquire automotive networking company Aviva Links
NXP Semiconductors has entered into a definitive agreement to acquire Aviva Links, a provider of Automotive SerDes Alliance (ASA) compliant in-vehicle connectivity solutions in an all-cash transaction valued at USD 242.5 million.
EU green lights €81M support to Diamond Foundry in Spain
Diamond Foundry Europe will receive EU support for setting up a new factory for the production of semiconductor-grade rough synthetic diamonds in Trujillo, Spain.
Denso and onsemi to boost self-driving tech
Denso Corporation and onsemi are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced driver assistance systems (ADAS) technologies.
GlobalWafers bags $406 million in CHIPS Act funding
The US Department of Commerce says it will grant GlobalWafers USD 406 million in direct funding under the CHIPS Incentives Program to increase domestic production of silicon wafers.
Aixtron opens new innovation centre
Aixtron has officially opened a new Innovation Centre at the company's headquarters in Herzogenrath. The new research and development complex with 1,000 square metres of cleanroom space lays the foundation for the transition to 300 mm wafer size in the compound semiconductor industry.
R&D, partnerships, and expansion: ST’s strategy for SiC growth
At this year’s Evertiq Expo in Gothenburg, Maurizio Ferrara, Deputy General Manager of STMicroelectronics’ New Materials Division, presented an outlook on the transformative role of silicon carbide (SiC) semiconductors in the industry. Following his presentation, Ferrara spoke about the opportunities driving SiC adoption and how ST is positioned to lead this critical market.
Bosch secures $225M to boost US chip production
Bosch has signed a preliminary memorandum of agreement (PMT) with the US Department of Commerce under the CHIPS and Science Act, paving the way for up to USD 225 million in potential funding to help upgrade its production site in Roseville, California.
WMG, Binghamton to collaborate on battery capabilities
The five-year MoU sets the foundation for sharing of academic, scientific and cultural experiences between the WMG, at The University of Warwick in the UK, and Binghamton University.
Infineon, Eve Energy sign battery management solutions pact
Infineon will supply a complete chipset, including microcontroller units, balancing and monitoring ICs, power management ICs, drivers, MOSFETs, controller area networks and sensor products.
Tivolt partners with Tata Power to boost EV charging
This partnership aims to build a robust EV charging ecosystem by leveraging Tata Power’s expertise in EV charging solutions with Tivolt’s network of small electric commercial vehicles across India.
Reliance NU Suntech secures 930 MW BESS project
Solar Energy Corporation of India (SECI) will enter into a 25-year power purchase agreement with Reliance NU Suntech. The solar power procured will be sold to power distribution firms in India.
Bosch sells security and communications unit to Triton
The purchase price of the sale was not disclosed. The transaction is expected to close by the end of the first half of 2025, subject to regulatory approvals.
Saab receives order for the U.S. Air Forces in Europe
Saab has received an order from BAE Systems in support of the U.S. Air Forces in Europe for multiple Giraffe 4A radar systems. According to the press release, the contract value is approximately $48M (525 MSEK).
Rohm, TSMC launch GaN partnership for EV sector
The partnership will integrate Japanese semiconductor company Rohm’s device development technology with TSMC’s GaN-on-silicon process technology.
Rio Tinto to invest $2.5 billion in Argentina
Rio Tinto has approved $2.5 billion to expand the Rincon project in Argentina. It will be the first company’s lithium operation on commercial scale. First production is expected in 2028 followed by a three-year ramp up to full capacity.
Marvell partners with Micron, Samsung, and SK hynix on custom HBM
Marvell says it has pioneered a new custom HBM compute architecture, enabling XPUs to achieve greater compute and memory density. The company is teaming up with Micron, Samsung, and SK Hynix to define and develop custom HBM solutions for next-gen XPUs.
Nvidia dismisses claims of reducing supplies to China
Nvidia has refuted recent social media claims suggesting the company plans to cut supplies to China.
DigiKey inks global distribution deal with MediaTek
DigiKey has expanded its product portfolio through a global distribution partnership with MediaTek, one of the world’s largest fabless semiconductor companies.
Rapidus collaborates with Cadence on leading-edge 2nm
Japanese semiconductor manufacturer Rapidus is collaborating with Cadence Design Systems to provide co-optimised AI-driven reference design flows and a broad IP portfolio.
Micron secures $6.1 billion CHIPS incentives for US expansion
The US Department of Commerce is awarding Micron Technology up to USD 6.165 billion in CHIPS Act incentives to expand its DRAM production facilities in Idaho and New York.
PI Ceramic upgrades production for multilayer tape technology
Piezoceramic specialist PI Ceramic has introduced a new, fully automated production line for multilayer technology to accelerate sample production for development projects.
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