Mike Doogue takes the helm as President and CEO of Allegro
Allegro MicroSystems has named Mike Doogue as President and Chief Executive Officer and as a member of the Board.
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Rick Madormo to lead Allegro’s global sales
Allegro MicroSystems has appointed Rick Madormo as Senior Vice President of Worldwide Sales, effective March 24, 2025.
New job cuts as Wolfspeed pushes for positive cash flow
In late January, Wolfspeed outlined a series of strategic initiatives aimed at improving financial performance and securing long-term growth. The plan focuses on three key areas: accelerating the path to positive free cash flow, strengthening the balance sheet, and raising cost-effective capital.
Teradyne to acquire Quantifi Photonics
Teradyne has entered into a definitive agreement to acquire Quantifi Photonics, a privately held company specialising in photonic integrated circuit (PIC) testing. The acquisition is expected to be finalised in the second quarter of 2025.
ASML and imec team up to advance European research and sustainability
ASML and imec have entered into a new five-year strategic partnership aimed at advancing semiconductor research and sustainability in Europe. The agreement will leverage both companies' expertise to drive technological innovation and sustainable initiatives in the semiconductor industry.
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DHL and Cox Automotive launch UK EV battery service center
DHL Supply Chain and Cox Automotive have announced a partnership to provide in-life EV battery services for customers.
Nearfield Instruments expands to the US
Dutch developer of advanced metrology and inspection solutions for the semiconductor industry, Nearfield Instruments, has established a US subsidiary – strengthening the company's presence in North America.
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Shannon Poulin to lead Teradyne's semiconductor test division
Teradyne has appointed Shannon Poulin as the next President of its Semiconductor Test Division, succeeding Rick Burns, who will retire on June 1, 2025. Poulin is set to take over in the second quarter of 2025 after a transition period.
Greaves teams up with Indofast for battery swapping
The partnership targets B2B fleets and ride-sharing services, offering electric two-wheeler and energy solutions designed to meet the evolving demands of the industry in India.
Kalyani partners with Compal to make servers in India
South Korea’s Compal Electronics will provide the Indian company with technological support related to servers, including overseeing local production, assembly, testing activities and final sales.
indie partners with GF to boost automotive radar tech
These high-performance radar systems-on-chip (SoC), manufactured on GlobalFoundries’ 22FDX platform, will target 77 GHz and 120 GHz radar applications for advanced driver assistance systems.
CDIL teams up with Infineon to make power chips
Under the agreement, German firm Infineon will supply bare semiconductor wafers to CDIL, which the Indian company will process and use for assembly and packaging to make power chipsets.
Finwave announces global distribution agreement with RFMW
This partnership between the two American companies represents a significant step in Finwave’s evolution from a technology-driven company to a product-driven company.
Infineon and ARAI to advance automotive semiconductor solutions
Infineon and the Automotive Research Association of India (ARAI) have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced semiconductor solutions for the Indian automotive sector.
US to hold over 20% of advanced chip capacity by 2030
The US is projected to hold 22% of global advanced semiconductor manufacturing capacity by 2030, driven by TSMC’s expanded investment in US production, according to TrendForce. TSMC has increased its total investment in its US operations to USD 165 billion, with three newly planned fabs set to begin mass production after 2030.
Allegro rejects onsemi's offer, calls It 'inadequate'
Allegro MicroSystems has confirmed receiving an unsolicited acquisition proposal from onsemi, offering USD 35.10 per share in cash. However, after reviewing the proposal, in consultation with independent financial and legal advisors, Allegro’s board of directors has deemed the offer inadequate.
onsemi launches $6.9 billion bid for Allegro MicroSystems
onsemi has disclosed a proposal to acquire Allegro MicroSystems for USD 35.10 per share in cash, an offer that implies a total enterprise valuation for Allegro of USD 6.9 billion.
Malaysia partners with Arm to boost semiconductor innovation
The Government of Malaysia has entered into a strategic partnership with Arm Limited through a Memorandum of Understanding (MOU) and contract, taking a significant step in the nation’s semiconductor and artificial intelligence (AI) development efforts.
Tata Electronics to set up display chip unit in Gujarat
Tata Electronics signed an MoU with Taiwan’s Himax Technologies and PSMC to boost India’s display and ultralow power AI sensing product and technology ecosystem.
Trump slams CHIPS act in congress – credits tariffs for investments
In an address to Congress on Tuesday, US President Donald Trump called the CHIPS Act a “horrible, horrible thing” and credited his administration's economic policies for a surge in domestic investment.
Intel postpones $28 billion chip manufacturing project
Intel has announced the postponement of its planned USD 28 billion chip manufacturing project in Ohio until 2030.
Mycronic receives order for an MMX metrology system
Swedish high-tech company Mycronic has received an order for an MMX metrology system from an existing customer in Asia.
Suzuki forms EV battery partnerships with Tata Gotion, FinDreams
India is set to play a critical role in Suzuki’s battery and EV strategy, positioning the country as a global hub for electric car production and export.
GF and MIT to advance research on essential chips for AI
GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) have entered into a new master research agreement aimed at advancing semiconductor technologies.
TSMC details its $100 billion Arizona investment
Building on its ongoing USD 65 billion investment in semiconductor manufacturing in Phoenix, Arizona, TSMC plans to invest an additional USD 100 billion, bringing its total US investment to USD 165 billion.
RRP Electronics partners with Deca to boost wafer packaging
India’s RRP Electronics will integrate Deca’s Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes.
TSMC to invest $100B in Arizona semiconductor operations
TSMC is planning to invest at least USD 100 billion in its Arizona semiconductor manufacturing operations, marking the largest foreign direct investment in U.S. history, US President Donald Trump announced alongside TSMC CEO C.C. Wei.
Microchip to cut 2,000 jobs in manufacturing footprint restructure
Microchip Technology has unveiled a significant restructuring plan aimed at streamlining costs and optimizing its manufacturing operations. This initiative expands on the company’s earlier decision to shut down its Fab 2 wafer fabrication facility in Tempe, Arizona, ahead of schedule.
Emerson, UT partnership to focus on AI, chip research
The three-year agreement includes research lab upgrades at The University of Texas at Austin facilities, and contributions to launch a new Semiconductor Science and Engineering program.
VCI, Kinesis to build semiconductor wire plant in Chennai
The 25,000-square-foot facility will focus on producing semiconductor bonding wires, a crucial component in chip manufacturing.
Idemitsu’s lithium sulphide plant will support Toyota’s EV goals
The facility at Idemitsu’s Chiba refinery, expected to be completed by mid-2027 at a cost of USD 143 million, will have a production capacity of 1,000 metric tons of lithium sulphide annually.
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