Jacobs secures design contract for CG Semi’s OSAT unit in Gujarat
As the project’s EPCS partner for the mini Line and the engineering partner for the main Line, Jacobs will play a critical role in helping CG Semi establish the semiconductor hub.
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LG Energy Solution to supply batteries to Mercedes affiliate
LGES plans to supply Mercedes with its 1.8-inch cylindrical batteries, which will be produced at a new facility being built in Arizona, the company’s second standalone factory in North America.
Bosch, Tenstorrent to partner on standardizing automotive chips
The two companies aim to bring new silicon products to the automotive industry faster and at reduced costs by combining different quantities and types of chiplets to form complete processors.
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KLA completes first phase of $200 million Singapore expansion
Electronics production equipment developer, KLA Corporation, has completed Phase 1 of its newest manufacturing facility.
Zeiss opens semiconductor applications lab in Dresden
Zeiss has recently opened the Zeiss Microscopy semiconductor applications lab in Dresden, a new facility dedicated to addressing physical analysis challenges and pushing the limits of nanoscale analysis with the Zeiss Crossbeam focused ion beam-scanning electron microscope (FIB-SEM).
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LG Innotek to use AI to clean up production
LG Innotek says that it has developed and implemented the industry's first "Artificial Intelligence (AI)-based inspection system for incoming raw materials", designed to detect defects at the point of receipt and prevent the use of substandard raw materials in the process.
Poland, Europe's top destination for back-end semiconductor production
According to recent research by Kearney, Poland has emerged as a key contender in the global semiconductor manufacturing ecosystem, particularly in the back-end segment.
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How to deal with semiconductor excess inventory
After allocation comes excess inventory. The panic buying of recent years, combined with strict terms from manufacturers and distributors have led to massive inventory buildups. So, how to get rid of excess smartly?
SK hynix opens office in Poland
South Korean memory manufacturer is opening a research and development center in Gdańsk, Poland.
Murata opens new silicon capacitor production line in France
Murata Manufacturing has broadened the scope of its Integrated Passive Solutions offering by opening a new production line at its site in Caen, France.
DuPont expands its photoresist manufacturing capacity
DuPont has completed a significant expansion for photoresist manufacturing capacity at its Sasakami site in Agano-shi, Niigata, Japan.
Amkor and TSMC partner on advanced packaging in Arizona
Amkor Technology and TSMC have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region's semiconductor ecosystem.
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Coherent boosts SiC 200mm n-type epitaxial wafer production
Coherent has launched its 200 mm silicon carbide (SiC) epitaxial wafers. The company is now shipping substrate and epi-wafers with thicknesses of 350 and 500 microns.
CT Semiconductor opens new training center
CT Semiconductor (a member of CT Group) has inaugurated the ATP Semiconductor Chip Technician Training Center at the National Innovation Center (NIC) in Hoa Lac High-Tech Park, Hanoi, Vietnam.
Exicom acquires US EV charging company Tritium for $37 million
Exicom plans to establish a manufacturing facility in Hyderabad that will utilize Tritium’s technology to create electric vehicle solutions.
CG Power acquires RF components unit of Renesas for $36 million
Through this transaction, CG will acquire IP, tangible assets and select employees across various functions such as semiconductor design, marketing and applications.
Rio Tinto in talks to buy lithium producer Arcadium
Though lithium prices have dropped 88% over the past two years, partly due to Chinese oversupply, its demand is expected to surge in this decade as production of lithium-ion batteries picks up pace.
Toyota invests $500 million in US electric air taxi company Joby Aviation
Toyota’s investment will be used to support certification and production of Joby’s electric air taxi, bringing Toyota’s total investment in Joby to USD 894 million.
Fujitsu, Supermicro to develop green AI computing tech
The two companies will also collaborate on developing liquid-cooled systems for HPC, Gen AI and next-generation green data centers.
Foxconn to invest $50 million in India in chip JV with HCL
The Taiwanese electronics manufacturing giant has purchased a 40% stake in a semiconductor JV for USD 37 million.
Rapidus unveils plans for new R&D facility and clean room
Rapidus Corporation will set up a clean room within Seiko Epson Corporation's facility in Chitose, Hokkaido, and open an R&D center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
5th COGD Obsolescence Day to focus on strategic risk management
The Component Obsolescence Group Deutschland (COGD) is hosting the 5th Obsolescence Day at electronica 2024 in Munich on November 15. The event will address the growing challenge of obsolescence in key components, materials, and software, which continues to pose risks to industrial production and maintenance.
Onto Innovation opens new packaging applications center
Onto Innovation has officially opened the company’s Packaging Applications Center of Excellence (PACE), a facility dedicated to panel-level packaging (PLP) innovations enabling 2.5D and 3D chiplet architectures and AI packages.
ST and Qualcomm team up on wireless IoT
STMicroelectronics and Qualcomm have entered a new strategic collaboration for the next generation of industrial and consumer IoT solutions augmented by edge AI.
Riber to deliver a MBE system to Finland
Molecular Beam Epitaxy (MBE) equipment supplier Riber announces the sale of a fully automated MBE 412 cluster platform in Finland.
UMC and Ngee Ann Polytechnic to strengthen semiconductor talent pipeline
UMC’s Singapore fab expansion is set to begin operations in 2026, and is expected to create significant job opportunities for engineering talents. The company has signed a Memorandum of Understanding (MOU) with Ngee Ann Polytechnic (NP) to enhance training for engineering talents and expand the workforce for the semiconductor industry.
Fujifilm to expand its semiconductor materials business
Fujifilm Corporation plans to invest JPY 20 billion (EUR 125 million) in its semiconductor materials business. The investment will strengthen the company's facilities for the development, production and quality evaluation of advanced semiconductor materials in Shizuoka and Oita, Japan.
Denso and Rohm considering strategic partnership
Denso and Rohm have agreed to start consideration of a strategic partnership in the semiconductor field.
Construction starts on Lam Research's Indian expansion
Lam Research has broken ground on a brand-new systems lab at its India Center for Engineering in Bengaluru.
Nio gets $1.9 billion injection from parent, investors
Strategic investors have agreed to invest USD 470 million in cash in Nio China. The carmaker has also agreed to invest USD 1.4 billion in cash to subscribe to the newly issued shares of Nio China.
UK buys chip factory for $27 million to secure military supply
The plant in Newton Aycliffe in northern England is the only secure domestic manufacturer of gallium arsenide semiconductors. The purchase is expected to save 100 skilled jobs.
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