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H38

May 01, 2026
Under the terms of the MOU, the companies will work to jointly build a 38-meter MUSV, configure vessel capabilities, develop state-of-the-art AI-driven robotic shipyards, and collaborate on advanced AI software for improving autonomy.

Toubro_logo

May 01, 2026
The new business vertical, L&T Electronic Products & Systems (LTEPS), will be headquartered in Bengaluru, while the manufacturing operations will be based in Coimbatore. To begin with, two manufacturing lines have been commissioned.

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team

May 01, 2026
QMatter’s current focus is the life sciences market, working with pharmaceutical and biotechnology companies to accelerate R&D by enabling better simulation data and ultimately improving research outcomes.

April 30, 2026
Kontron will deliver advanced cybersecurity capabilities across several institutions in CEE. The project, valued at approximately EUR 20 million, is being implemented in collaboration with Darktrace, a company in the AI-powered cyber defence space.

Expo-ZRH26-claus-speaking

April 30, 2026
During Evertiq Expo Zurich on April 23, 2026, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a pointed assessment of a semiconductor industry growing rapidly — but not evenly. In his keynote and a follow-up conversation, Aasholm argued that while headline figures suggest unprecedented expansion, underlying dynamics point to structural imbalances across the supply chain.

Oulu-Factory-Finland

April 29, 2026
Finnish PCB manufacturer Aspocomp closed the first quarter of 2026 with its highest-ever order book, even as revenue and profitability declined against a strong comparison period.

Valtech_agreement

April 29, 2026
By combining Indian company MELSS’s manufacturing expertise with Valtech’s global strengths, the joint venture is positioned to deliver high-performance solutions that meet the evolving needs of next-generation electronics.

EV_charging_Pixaline

April 29, 2026
Through this collaboration, Everged and Georgia Green Energy will introduce flexible, scalable business models designed to remove traditional barriers to EV charging adoption and accelerate deployment while ensuring long-term system performance and profitability.

Tuscaloosa-Alabama-facility

April 28, 2026
US semiconductor company Microchip Technology has opened a new manufacturing facility in Tuscaloosa, Alabama, to increase production capacity for its hydrogen masers and reduce lead times.

SmartMCD

April 28, 2026
TB9M030FG is suitable for sensorless control of the three‑phase brushless DC motors used in automotive applications, such as electric water pumps, electric oil pumps, electric fans and electric blowers.

PCB-India_1

April 27, 2026
Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.

li-battery_1

April 27, 2026
The Australian startup is developing a locally deployable solution to recover critical minerals within domestic or regional supply chains, reducing reliance on exporting battery waste and offshore refining.

BMIT_MoU

April 24, 2026
This strategic partnership aims to strengthen efforts towards fostering indigenous design and production capabilities in advanced technology domains critical to national defence.

KOG_signing

April 24, 2026
This is the second series of submarines to be equipped by Indra with its latest generation fully digital electronic warfare systems and state-of-the-art navigation radar, bringing the total number of platforms fitted with these capabilities to 12.

April 24, 2026
The funding will support the construction of Altilium’s new ACT3 recycling facility, the UK’s first commercial refinery for recovery of critical battery materials from end-of-life EV batteries.

SOCAMM2

April 24, 2026
SOCAMM2 is a module that adapts low-power memory — which was previously used mainly in mobile products like smartphones — for server environments. It is designed to be a primary memory solution for next-generation AI servers.

Veloce_proFPGA

April 24, 2026
Nvidia and Siemens have been able to capture tens of trillions of cycles over a span of just a few days by taking advantage of Siemens’ Veloce proFPGA CS scalable and performance-optimized hardware architecture and combining it with Nvidia’s performance-optimized chip architecture.

Top-30

April 23, 2026
The global EMS/ODM industry continues to expand, but scale and growth remain unevenly distributed, with Asian players flexing their dominance while Europe lags behind, according to new research from in4ma and EMSNOW.

TSMC

April 23, 2026
TSMC is working with Siemens to enhance productivity in custom integrated circuit (IC) design to enable multi-step, multi-tool automations for DRC-centric physical verification with Siemens’ Calibre software.

DRS_logo

April 23, 2026
These Missile Defense Agency (MDA) Scalable Homeland Innovative Enterprise Layered Defense (SHIELD) indefinite-delivery/indefinite-quantity (IDIQ) contracts encompass a broad range of work areas that allow for rapid delivery of innovative capabilities.

SDI_Mercedes_Benz

April 23, 2026
Under the agreement, Samsung SDI will supply high-performance batteries for Mercedes-Benz’s next-generation electric vehicles. Mercedes-Benz plans to use the batteries in future compact and mid-size electric SUVs and coupe models.

Microsystems

April 23, 2026
This strategic investment will accelerate Spark’s expansion and commercialization momentum for LE-UWB technology as customer demand surges for wireless solutions capable of meeting the performance and power requirements of intelligent edge devices.

Destinus_JV

April 22, 2026
The joint venture to be set up during the second half of 2026 will manufacture, market and deliver advanced missile systems, including cruise missiles and ballistic rocket artillery.

April 22, 2026
The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.

quantum-technologies-1

April 22, 2026
Sygaldry servers are designed to address constraints in AI training and inference by operating alongside classical infrastructure within the data center. The company is also developing quantum algorithms that plug into the tools AI researchers already use.

circuit-board

April 22, 2026
As global supply chains remain under pressure and geopolitical uncertainty continues to reshape sourcing strategies, partnerships built on local capabilities are gaining importance. In this context, two Polish companies — Unisystem and SoMLabs — have announced a closer collaboration aimed at jointly delivering technology projects based on complementary products and expertise.

X-raymetrology_Onto

April 22, 2026
By combining Rigaku’s X-ray technologies with Onto Innovation’s complementary optical metrology and advanced analytics software, the companies aim to deliver next-generation hybrid metrology solutions for increasingly complex semiconductor devices.

InductEV

April 22, 2026
The acquisition secures a robust supply chain that balances Israeli company Electreon’s offshore manufacturing efficiencies with InductEV’s Build America Buy America (BABA) compliant offerings.

PCB-Japan_2

April 21, 2026
A magnitude 7.7 earthquake struck off the coast of northern Japan on April 20, prompting a brief tsunami alert and a government advisory warning of an elevated risk of a potential megaquake, the Associated Press reports.

Mechelen-manufacturing-site

April 21, 2026
Aumovio plans to divest its manufacturing site in Mechelen, Belgium, to Dumarey Group, as part of efforts to optimise its production footprint.

Electronics_REF_ARIF240GaN

April 21, 2026
REF_ARIF240GaN is specifically designed to support the launch of EZ-PD PMG1-B2, Infineon’s newest USB PD 3.2 controller, featuring up to 240W USB sink capability and integrated buck-boost functionality in a compact single package.

Aerospace_F404

April 21, 2026
The depot facility for F404 -IN20 engines will be owned, operated and maintained by Indian Air Force (IAF) with GE Aerospace providing technical inputs, training, support staff and supply of necessary spares and specialized equipment.

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