Allego partners with KREISEL to deploy battery-integrated chargers
May 09, 2025
Allego will install KREISEL’s CHIMERO high-power chargers across its network of en-route and destination sites. The KREISEL CHIMERO enables locations where a separate battery system is not feasible.
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AOS enables 48V hot swap in AI servers with high SOA MOSFET
May 09, 2025
The AOTL66935 hot swap MOSFET prevents damage to the system by limiting the high inrush current with low power losses due to the very low on-resistance.
IBM, Oracle expand partnership to advance agentic AI, hybrid cloud
May 09, 2025
To give customers a consistent way to build and manage agents across multi-agent, multi-system business processes, spanning both Oracle and non-Oracle applications and data sources, IBM is making its watsonx Orchestrate AI agent offerings available on Oracle Cloud Infrastructure.
MKS breaks ground on $40M chemical manufacturing plant in Thailand
May 08, 2025
MKS Instruments has broken ground on its new Atotech chemical manufacturing and TechCenter facility at the Asia Industrial Estate Suvarnabhumi, located east of Bangkok, Thailand. The investment is valued at over USD 40 million.
imec spin-off eyeo raises €15 million to give cameras perfect eyesight
May 08, 2025
eyeo, a new imec spin-off, has raised EUR 15 million in seed funding, co-led by imec.xpand, Invest-NL, joined by QBIC fund, High-Tech Gründerfonds (HTGF) and Brabant Development Agency (BOM). The spin-off aims to revolutionise the imaging market for consumer, industrial, XR and security applications by drastically increasing the light sensitivity of image sensors.
Scanfil expands US manufacturing with second line in Atlanta
May 08, 2025
EMS provider Scanfil says that it will invest EUR 2.4 million in a second electronics manufacturing line at its Atlanta, USA facility, aiming to meet growing customer demand in the US market.
ABB's YuMi becomes a burger-flipping robot
May 08, 2025
ABB Robotics is serving up the future of fast food with BurgerBots – a robotics restaurant concept launched in Los Gatos, California. The automated kitchen uses ABB’s IRB 360 FlexPicker and YuMi collaborative robot.
Ferrotec breaks ground on second manufacturing facility in Kulim
May 07, 2025
Ferrotec Holdings Corporation has officially broken ground on its second high-technology manufacturing facility in Kulim, Kedah, Malaysia, marking a MYR 1 billion (USD 226 million) investment aimed at strengthening its precision manufacturing capacity for semiconductor components.
Smart Photonics speed up production set up with Aixtron
May 07, 2025
Aixtron supplies the Netherlands-based Indium Phosphide (InP) foundry Smart Photonics with its new G10-AsP system. The MOCVD solution for high-volume production of GaAs/InP materials will enable the foundry to increase its capacity and capabilities.
Siemens and Intel expand collaboration on IC and packaging solutions
May 07, 2025
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
Sustio completes €68.5M expansion, doubling HDI capacity in Penang
May 06, 2025
Sustio Sdn. Bhd., a subsidiary of South Korea's Simmtech Group, has completed its second manufacturing facility in Batu Kawan, Penang, following an investment of MYR 326 million (EUR 68.5 million). The expansion effectively doubles Sustio’s high-density interconnect (HDI) manufacturing capacity.
IBM, TCS team up to deploy India’s largest quantum computer
May 06, 2025
IBM and the Andhra Pradesh government have entered into discussions that aim for the Quantum Valley Tech Park to be anchored by an IBM Quantum System Two installation, with a 156-qubit Heron quantum processor.
AT&S starts high-volume manufacturing at new Kulim plant
May 06, 2025
IC substrate and PCB manufacturer AT&S is commencing high-volume manufacturing at its new facility in Kulim, Malaysia. AT&S Malaysia will deliver high-end IC substrates for AMD’s data centre processors, as well as for other customers.
KIST develops ultrasonic wireless battery charging technology
May 06, 2025
The receiver overcomes many of the limitations of existing wireless power transmission methods while improving biocompatibility, and is expected to be applied to next-generation wearable and implantable electronic devices.
MeTime Healing receives grant to develop AI-powered mental health platform
May 05, 2025
MeTime Healing received $125,000 from the Montgomery County Technology Innovation Fund in Maryland to address the growing mental health crisis.
Novo Energy to cut workforce by 50% following Northvolt collapse
May 05, 2025
Novo Energy says that it will reduce its workforce by approximately 50% and implement a broader reorganisation of its operations in response to the bankruptcy of Northvolt, its former technology partner.
IIT Madras launches two silicon photonics products
May 05, 2025
An R&D centre at IIT Madras has developed a fibre array attachment tool in partnership with izmo Microsystems, which will be integrated with izmo’s packaging facility for photonics chip packaging. The centre also launched a high-speed silicon photonics QRNG.
Tasmania’s Incat launches ‘world’s largest battery-electric ship’
May 05, 2025
When it enters service between Buenos Aires and Uruguay, the 130 metre-long vessel, called Hull 096, will operate entirely on battery-electric power, carrying up to 2,100 passengers and 225 vehicles across the River Plate.
VSORA raises $46M to bring powerful AI inference chip to market
May 05, 2025
The investment was led by Otium and a French family office with additional participation from Omnes Capital, Adélie Capital and co-financing from the European Innovation Council (EIC) Fund.
QuantumScape, Murata announce framework for ceramics collaboration
May 05, 2025
US firm QuantumScape (QS) and Japan’s Murata Manufacturing have entered into the first phase of an agreement to explore a partnership for high-volume manufacturing of ceramic film for QS’s solid-state battery tech.
Chinese skyscraper-cleaning robot deal with U.S. suspended
May 05, 2025
Chinese robotics company Lindu Intelligent Technology has suspended a $1.6 million deal with a U.S. client due to the impact of tariffs.
Southampton opens E-beam lithography chip facility
May 05, 2025
University of Southampton’s new E-beam lithography facility, just the second in the world, provides incredible accuracy critical to designing the tiny components that power technologies of the future.
NEXT partners with BAE to develop next-gen space-qualified chips
May 05, 2025
NEXT’s latest APU, the NX450, is the world’s first 200 GS/s antenna processor with 100-GHz of instantaneous RF bandwidth split across four independent receive and transmit channels respectively.
Siemens, O₂ Telefónica partner to enhance 5G network slicing
May 02, 2025
The solution “5G Slice for the Water Industry” allows water utilities in Germany to monitor and control their entire system of automation technology over a virtual 5G network using 5G network slicing technology.
Forge Nano’s battery and chip ambitions get $40M boost
May 02, 2025
Forge Nano’s total capital investment now exceeds USD 140 million, adding RockCreek to a shareholder roster that includes GM Ventures, Volkswagen, LG Technology Ventures, Hanwha, Mitsui Kinzoku, Sumitomo Corporation of Americas, Air Liquide, Catalus Capital and SBI Investment
Zoho suspends $700 million India chipmaking plan
May 02, 2025
In June 2024, the Indian company had applied for government incentives under the India Semiconductor Mission (ISM) to build a compound semiconductor chip fabrication unit in Karnataka.
OKI develops 124-layer PCB tech for AI chip testing tools
May 02, 2025
This is a 15% increase in the number of layers over conventional 108-layer designs. Japan’s OKI Circuit Technology is seeking to establish mass production technology by October 2025 at its Joetsu plant.
LG Innotek targets $700M in FC-BGA sales with ‘Dream Factory’
May 01, 2025
LG Innotek has officially unveiled its fully automated semiconductor substrate plant, dubbed the “Dream Factory,” with the goal of growing its Flip Chip Ball Grid Array (FC-BGA) business into a USD 700 million operation by 2030.
Teledyne names George Bobb as CEO
April 30, 2025
Teledyne Technologies Incorporated has named George C. Bobb III as its President and Chief Executive Officer, effective immediately.
Dust, water and radar – a hidden threat to autonomous vehicle reliability
April 30, 2025
A key challenge in autonomous driving technology – how dust and moisture contaminants impair the reliability of automotive radar sensors – will be in focus during a presentation by Jeongmin Kang, Postdoctoral Researcher at Halmstad University, at the upcoming Evertiq Expo Malmö on May 15, 2025.
NTT signs MoU to set up $1.2B AI data centre cluster in Hyderabad
April 30, 2025
Japan’s NTT DATA, Mumbai-based Neysa Networks and the Telangana government will partner to establish the facility that will feature a 400 MW data center cluster and host AI supercomputing infrastructure.
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