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Kinisi_Robotics

June 26, 2026
Bristol-based Kinisi Robotics has been building on Bear’s production navigation stack since the company was founded — the same technology that powers Bear’s commercial fleet.

Airbound_MOU

June 26, 2026
The initiative is expected to begin with operations in Guntur in Andhra Pradesh, with both parties working towards enabling 10,000 daily drone flights across the state over the coming year.

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Cleenroom-slovakia

June 26, 2026
Incap Electronics Slovakia has invested in cleanroom production capability at its Námestovo facility in Slovakia to support customers with contamination-sensitive assembly requirements, particularly in semiconductor-related applications.

headquarters_Sheffield

June 26, 2026
The UK startup’s goal is to deliver quantum computers at scale based on photonics, leveraging chip manufacturing supply chains, working with industry leaders to deliver real-world impact in advanced manufacturing, defence, clean energy and healthcare.

June 26, 2026
At full deployment, 30 MW of dedicated AMD compute across Rackspace’s footprint will represent meaningful capacity to serve regulated enterprise workloads, including healthcare providers who have expressed early interest in accelerated compute.

DACPOL-Dominik-Kowalczyk-Krakow-2026

June 25, 2026
The effectiveness of modern defence systems is no longer defined solely by the number of tanks, aircraft, missile launchers, or soldiers. Increasingly, real military capability depends on the reliability of the electronics responsible for maintaining communications, surveillance, data processing, and weapons control.

expo-Berlin-2026-05

June 25, 2026
Siemensstadt was a deliberate choice for the move of Evertiq Expo Berlin. The district was once a city within a city – an entire industrial ecosystem built around a single company, now being reimagined for the next generation of technology. It felt like the right place for a day spent discussing what European electronics manufacturing is, and what it needs to become.

IIT_Hyderabad_MOU

June 25, 2026
As part of this collaboration, the Centre for Development of Telematics (C-DOT) is establishing a Centre of Excellence (CoE) at IIT Hyderabad to accelerate research, innovation and capacity building in advanced communication domains in India.

NatPower

June 25, 2026
Projects under the agreement will be sited in Italy and the UK and will be owned and operated by NatPower. Tesla will provide Megapack, their BESS as well as EPC and bankable trading services, with long-term revenues warranties.

June 24, 2026
Nokia and Lenovo have signed a multi-year, multi-technology patent cross-license agreement. The terms are confidential. The two companies previously signed a similar agreement in 2021.

Munich-facility

June 24, 2026
The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.

quantum-technologies-1

June 24, 2026
By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.

Space_AI

June 24, 2026
The investment will accelerate the commercial rollout of Irish firm Ubotica’s Live Maritime Intelligence platform, which enables governments and maritime agencies to detect emerging threats across maritime territories in real time.

sign

June 24, 2026
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.

production-2026

June 23, 2026
Canadian EMS provider Celestica is expanding its campus in Richardson, Texas, in the United States, to approximately one million square feet. The USD 300 million investment over the next two years is expected to create nearly 2,300 new jobs and retain around 400 existing positions.

June 23, 2026
Robert Bosch GmbH has agreed to pay a USD 36 million penalty to the US Bureau of Industry and Security after shipping MEMS sensor products and software to Huawei and its affiliates without the required export licence. The shipments took place between September 2020 and September 2024.

Cathie-Gridley-EVP-and-President-Aerospace-Defense

June 23, 2026
TTM Technologies has opened a new Ultra-HDI printed circuit board manufacturing facility in Syracuse, New York, in the United States. The USD 130 million investment – including USD 30 million from the US Department of War – is set to create up to 400 new jobs and bring TTM's total workforce in the region to approximately 1,000.

Prologium_MOU

June 23, 2026
France’s OPmobility will be responsible for the design, development and manufacturing of battery modules utilizing the solid-state battery cells provided by Taiwanese company ProLogium.

satellite

June 23, 2026
Under this multi-year development award, Viasat’s Space and Mission Systems (SMS) team will produce and deliver a dual-band X/Ka-band mini-GEO, maneuverable satellite, and provide ground stations and operations support.

Dallas_office

June 22, 2026
The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US.

June 22, 2026
The joint program includes a multi-year plan focused on solid-state battery development and associated manufacturing processes. The agreement follows Honda’s successful completion of a technology evaluation agreement with QuantumScape Corporation (QS).

expo-Berlin-2026-01

June 22, 2026
Evertiq Expo Berlin 2026 took place on June 18 at TEC Event Campus in Berlin's Siemensstadt district – a new venue for the event, which previously called Technology Park Berlin Adlershof home. The day brought together 328 people from 199 companies, with 163 visitors meeting 78 exhibiting companies.

funds_PabitraKaity

June 22, 2026
Channel Robotics is developing a patented handheld AI-enabled endoscopic robotic platform designed to deliver robotic-level dexterity through existing flexible endoscopes.

Energy_IES_MOU

June 22, 2026
The collaboration is expected to add significant wind power, solar, and energy storage capacity and help create an AI-powered energy infrastructure that integrates energy systems with intelligent systems.

Exolaunch

June 22, 2026
EQT will support Exolaunch in scaling its global operations and investing into the development of new satellite launch and deployment technologies. It will also help drive the expansion into additional services across the satellite mission lifecycle.

June 19, 2026
With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.

Mahindra_Viam

June 19, 2026
As a core partner in physical AI, Viam will work with Tech Mahindra to provide their global enterprise clients with direct access to the Viam platform for managing and maintaining robotic fleets at scale.

Science_logo

June 19, 2026
The acquisition expands Brewer Science’s advanced materials portfolio and strengthens its ability to support semiconductor customers with highly specialized, ultrapure chemical solutions critical to advanced lithography and microdevice fabrication.

hynix_HBM4E

June 19, 2026
The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models.

Edge_deal

June 19, 2026
The two companies have also announced a joint venture term sheet for the co-development of an extended-range precision-guided weapon based on the Hammer family.

building_logo

June 18, 2026
The installation of Aixtron’s G10-GaN system at the Hamamatsu plant supports Rohm’s transition toward increased vertical integration and strengthens its ability to scale production for next-generation power semiconductor applications.

quantum-technologies-1

June 18, 2026
The agreement creates a foundation for the companies to jointly identify high-impact industrial use cases and explore quantum and hybrid quantum-classical approaches for next-generation engineering workflows.

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