Mitsui Kinzoku to build ¥190 billion copper foil plant in Malaysia November 13, 2026 Mitsui Kinzoku will build a new copper foil plant in Malaysia, with production starting in phases from April 2031. The Japanese materials maker says the expansion is needed to keep up with continued rapid growth in AI and semiconductors.
Hitachi Energy invests over $330M in transformer insulation factory in Ontario November 13, 2026 Expected to be completed by 2028, the planned 21,000-square-meter facility will manufacture electrical insulation pressboard and laminates critical to transformer production and operation and is expected to create over 100 permanent skilled jobs.
HTV Alter Technology's Klaudia Cyzio on component shortages and grey market November 13, 2026 Growing demand driven by advances in artificial intelligence is exacerbating problems with the availability of electronic components. Manufacturers are increasingly having to source components outside official distribution channels, raising the risk of buying counterfeit products or parts that are unsuitable for assembly. Klaudia Cyzio from HTV Alter Technology discussed these industry challenges in an interview conducted during Evertiq Expo 2026 in Warsaw.
Quantinuum, GE Vernova collaborate to advance superconductivity research November 13, 2026 By combining Quantinuum’s full-stack quantum computing capabilities with GE Vernova’s expertise in material science and engineering simulation applied to industrial applications, the collaboration will bring an industry perspective to a promising area of quantum research.
Astrome secures $7 million to develop AI-ELINT constellation November 13, 2026 The project, with a total project cost of approximately USD 13.5 million, aims to develop a sovereign AI-enabled Electronic Intelligence (AI-ELINT) constellation for Indian national security applications.
SCREEN to secure additional production capacity in Kyoto November 13, 2026 The total investment in the expansion is about USD 155 million. The building will be renovated, introducing cleanrooms and other arrangements to make it suitable for semiconductor production equipment (SPE) production.
Analog Devices completes acquisition of Alif Semiconductor November 13, 2026 In September, Analog Devices, Inc. (ADI) and Alif Semiconductor had announced that they had entered into a definitive agreement under which ADI would acquire Alif in an all-cash transaction for USD 1.35 billion.
Siemens to acquire debug and trace solutions provider Lauterbach November 13, 2026 German firm Lauterbach develops comprehensive, modular and extensible development and verification tools for microprocessors and embedded CPU cores in the form of hardware-assisted debuggers and real-time trace tools.
Incap and Rantelon team up on electronic warfare for drone makers November 12, 2026 EMS provider Incap’s German subsidiary and Estonian defence electronics company Rantelon are starting a sales and business development partnership. The aim is to bring Rantelon’s radio frequency and electronic warfare technologies to makers of unmanned systems in Germany, Austria and Switzerland.
Luminovo opens its supply chain platform to AI assistants November 12, 2026 German software company Luminovo is opening its platform for electronics quoting and procurement to AI assistants such as ChatGPT, Claude and Microsoft Copilot. EMS providers and electronics manufacturers will be able to query their own supply chain data in plain language, and build their own tools on top of it.
Arrow launches Capstone as dedicated IP&E business November 12, 2026 Arrow Electronics has launched Capstone, a new global business dedicated to interconnect, passive and electromechanical (IP&E) components. The launch is part of a wider realignment of Arrow’s components business, which is moving from a geographic to a technology-based operating model.
Sivers signs global distribution agreement with WT Microelectronics November 12, 2026 With a 15% global market share, WT Microelectronics will serve as a strong global distribution partner for Sivers’ InP (Indium Phosphide) lasers and wireless beamformer products and solutions, connecting its product portfolio and availability at scale with customers globally.
Sanken, Kaynes to explore partnership in manufacturing LEDs, power devices November 12, 2026 The collaboration seeks to boost the companies’ competitive position in India’s market. By leveraging their resources and capabilities, Sanken Electric and Kaynes aim to mitigate risks associated with fluctuations in demand while maximizing investment efficiency.
Steliau Technology completes acquisition of Acal BFi November 11, 2026 French electronics distributor Steliau Technology has completed its acquisition of the UK-based Acal BFi Group, which includes Impulse Embedded and Arcobel Embedded Solutions. The combined group will have revenue approaching EUR 1 billion.
Amkor breaks ground on new building in South Korea November 11, 2026 Amkor has broken ground on an expansion of its campus in Gwangju, South Korea, to meet rising demand for advanced packaging for AI and accelerated computing. The new building will add capacity at a site that has been part of Amkor’s Korean operations since the 1990s.
High DRAM prices push smartphone makers towards reballed memory November 11, 2026 Rising contract prices for mobile DRAM are leading more smartphone brands to use reballed memory in their cheapest models. According to TrendForce, reballed memory will account for about 3–4% of the smartphone market in 2026, and could reach 7–9% in 2027.
SCHMID wins equipment order for glass core substrate plant in South Asia November 11, 2026 German equipment maker SCHMID Group has received an order for wet-process equipment for a new glass core substrate plant in South Asia. The customer is a US company specialising in glass-based advanced packaging, which is now moving its technology from pilot production to industrial scale.
Cicor wins two multi-year defence programmes and completes Malaysia deal November 11, 2026 Swiss EMS provider Cicor has won two multi-year defence programmes, one of them from a new customer. The two awards are expected to generate revenue of close to CHF 20 million as early as 2027.
AI is splitting the PCB industry in two, says Yole November 11, 2026 The PCB industry ended 2025 with revenue of about USD 88 billion and is forecast to reach USD 140 billion by 2031, an average annual growth rate of 8%. But according to Yole Group, that average hides two industries moving in opposite directions: an AI segment growing by 45 to 70% a year, and a commodity segment that is barely growing at all.
Foxconn, Mitsubishi Electric finalise alliance for automotive equipment business November 11, 2026 Under the agreement, Mitsubishi Electric will transfer to Lin Yin 50% of its stake in Mitsubishi Electric Mobility, which handles Mitsubishi Electric’s automotive equipment business, after which the two co-owners will jointly operate Mitsubishi Electric Mobility.
Würth Elektronik and Starteam Global team up on PCB sourcing November 10, 2026 Würth Elektronik and German PCB manufacturer Starteam Global are expanding their cooperation into a strategic partnership. The first step is a joint online PCB shop, and customers will also get access to the two companies’ combined manufacturing networks in Europe and Asia.
European component distribution up 43% in Q3 as memory prices soar November 10, 2026 European distribution of electronic components grew by 42.7% YoY to EUR 5.4 billion in the third quarter, according to DMASS. For the first nine months, sales rose by 30.2% to EUR 15.0 billion.
Gabor Sirom on Empa Electronics' strategy: R&D, expansion and acquisitions November 10, 2026 Empa Electronics reported a 26% increase in revenue in the first half of 2026 compared with the same period a year earlier. The Turkish company plans to sustain its growth through R&D investment, geographical expansion and acquisitions of technology companies. Speaking to Evertiq at Evertiq Expo Warsaw 2026, Gabor Sirom of Empa Electronics discussed the company's strategy, the state of Turkey's electronics industry and the outlook for the wider market.
Paras, BroadPak to develop advanced packaging facility in India November 10, 2026 The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification.
Ventec and MICAM plan CCL production in Ireland November 09, 2026 Taiwanese laminate maker Ventec International Group and MICAM are developing a joint venture to start production of copper-clad laminate (CCL) at MICAM’s plant in Mallow, Ireland. The aim is to give European customers a source of PCB base materials for defence applications made within the EU.
India approves $1.5 billion scheme for development of 92 GWh ESS November 09, 2026 The Viability Gap Funding (VGF) scheme will support creation of new capacities equivalent to 170% of the present-day grid-scale energy storage system (ESS) capacity in India, and help meet the required grid-scale ESS capacity of 411 GWh by 2031-32.
Nvidia, Rebellions, SK Telecom to advance sovereign AI infrastructure November 09, 2026 Supported by Korea’s Ministry of Science and ICT (MSIT), the collaboration aims to support AI services tailored to Korea’s language, industries and priorities, connecting Korean semiconductor development with the systems and operational capabilities needed to deliver AI at scale
Micron advances memory innovation with ultra-dense module for servers November 09, 2026 The 512GB DDR5 module vertically stacks DRAM dies interconnected by through-silicon vias (TSVs) to maximize density within individual DRAM packages while preserving the performance modern data center architectures demand.
LX Semicon mass produces LX61101 for Hyundai Motor, Kia November 09, 2026 LX61101 is an MCU optimized for motor control in automotive body electronics. Beginning with vehicles that Hyundai Motor and Kia plan to produce in the second half of this year, LX61101 will be applied to a broader range of vehicle models.
IonQ completes acquisition of Zero Trust security firm Elisity November 09, 2026 The combination extends IonQ’s quantum security strategy, adding Zero Trust technology that complements IonQ’s post-quantum cryptography (PQC) and quantum key distribution (QKD) capabilities.
onsemi scraps $2 billion SiC expansion in the Czech Republic November 09, 2026 onsemi will not go ahead with the planned expansion of its site in Rožnov pod Radhoštěm, which would have added end-to-end silicon carbide (SiC) production in the Czech Republic. The company and the Czech Ministry of Industry and Trade have agreed to conclude the project, which was announced in June 2024 as an investment of up to USD 2 billion.
Sponsored content by TME Transfer Multisort Elektronik Overview of Display Elektronik's Offer Various types of displays remain the most user-friendly elements of human-machine interfaces (HMIs) – they are intuitive, provide programmers with a way to convey clear messages, and are easy to connect to microcontroller-controlled devices.