Amkor breaks ground on new building in South Korea
Amkor has broken ground on an expansion of its campus in Gwangju, South Korea, to meet rising demand for advanced packaging for AI and accelerated computing. The new building will add capacity at a site that has been part of Amkor’s Korean operations since the 1990s.
The Gwangju campus already has about 152,000 square metres of manufacturing space, with capabilities including wafer bumping, FCBGA, fcCSP, system-in-package, wafer-level packaging and test, according to a blog post from Amkor. The groundbreaking took place on 29 October.
The expansion is part of a USD 1.3 billion agreement with Nvidia, which takes Amkor’s multi-year agreements with Nvidia in Arizona and South Korea to a total of USD 3 billion. Under the agreements, Nvidia makes prepayments that, according to Amkor, align its manufacturing capacity with Nvidia’s long-term growth plans. In Korea, Amkor is also expanding in Songdo, home to its global R&D centre, which works on technologies such as high-density fan-out, 2.5D TSV, FCBGA and system-in-package.
“These investments build on our global manufacturing footprint and strengthen our ability to support customers through our operations in both the United States and South Korea,” Kevin Engel, president and CEO of Amkor Technology, said in the press release announcing the expanded partnership.
Amkor does not say how large the new building will be, how much it is investing in it or when it will be completed.
