IPC becomes Global Electronics Association
The organization known as IPC – originally the Institute of Printed Circuits – is changing its name to the Global Electronics Association, and unveils a new study on the electronics industry.
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Why PCB raw materials matter: performance, reliability, and cost
ICAPE offers an overview of the key factors in PCB raw material selection and the considerations that guide their use.
U.S. imposes new export restrictions on chip design software to China
The United States has instructed a wide range of companies to halt shipments of various products to China without a license, and has revoked previously issued licenses for certain vendors, according to a report from Reuters.
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Raytac Bluetooth Low Energy modules in TME's offer
Contemporary communication has been dominated by wireless systems. Electronics increasingly rely on data exchange without the use of cables. This applies to household appliances, as well as industrial, medical automation, and Internet of Things solutions. One of the most commonly used short-range communication standards is Bluetooth, particularly its energy-efficient variant, Bluetooth Low Energy (BLE), which allows for the construction of compact battery-powered devices.
Pasi Pylväs: “The Chips Act isn’t the complete solution”
At this year’s Evertiq Expo Tampere, Pasi Pylväs – director of the Finnish Chips Competence Center – gave a presentation covering the current state of European chip manufacturing, what The EU Chips Act gets right, and what still needs to be done in order to secure the industry’s future.
Student invention takes aim at phone scammers
Two Swedish high school students are developing a mini-computer that detects phone scammers – an invention that could help protect vulnerable individuals from fraud.
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What an EMS Laboratory Actually Finds When Electronics Fail
Most field failures that reach our laboratory are not exotic. They are the same handful of mechanisms, year after year. What varies is where they were introduced — and in the majority of cases we investigate, the durable fix turns out to be a design change rather than a process adjustment.
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