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Toppan boosts FC-BGA substrate production for AI chips

December 17, 2025
Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.


Ewelina-Bednarz_Column-1

Seven defense technologies driving electronics demand in 2025

December 17, 2025
During this year’s Evertiq Expo in Kraków, the topic of defense electronics filled the conference room to capacity. The top list of defense companies I presented turned out to be only a starting point for conversations that continued long after the session had ended. Behind each of these manufacturers stand dozens of electronics suppliers: semiconductor producers, PCB and RF module manufacturers, and specialized EMS companies. So I asked myself a simple question: which defense technologies drove electronics demand most strongly in 2025? Let’s look at them from the industry’s point of view rather than from a catalogue of weapon systems.





















Yttrium

GE Vernova boosts yttrium reserves as rare-earth pressure intensifies

December 10, 2025
GE Vernova is working with the U.S. government to secure additional yttrium supplies amid tightening global availability. According to information reported by Reuters, the company has now stockpiled enough material to support turbine manufacturing into 2025 and potentially into 2026. While no detailed timeline was provided, GE Vernova confirmed that alternative materials are being evaluated in case market conditions deteriorate further.








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© 2025 Evertiq AB December 11 2025 2:54 pm V25.8.6-1
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