Evertiq - First In Electronics News & Expo

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April 01, 2026
TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.

PCB-India_2

April 01, 2026
India’s electronics manufacturing sector produced goods worth USD 125 billion in the year to March 2025. The government hopes to increase this to USD 500 billion by fiscal 2031.

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Grumman_SEWIP_Block3

April 01, 2026
SEWIP Block 3 is a US Navy program that uses advanced electronic attack to protect surface ships from missiles, improving ship survivability.

Shipyard_HBL_MOU

March 31, 2026
The collaboration will focus on the development of advanced marine batteries, battery management systems, electric motors, power electronics and charging infrastructure. The JV aims to cater to both Indian and international markets.

Molten_MOU

March 31, 2026
Under the arrangement, Molten will produce graphite via methane pyrolysis, which Posco Future M will then process into spherical graphite through its subsidiary FutureGraph before producing natural graphite anode material at its Sejong plant.

power_modules

March 30, 2026
The UCC34141-Q1 and UCC33420 isolated power modules leverage Texas Instruments’s IsoShield technology, a multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs.

University_QpiAI

March 30, 2026
The centre is expected to serve startups, multinational technology companies, academic researchers, and members of the defence and aerospace sectors located in and around Bengaluru.

Compass_Swissto12

March 30, 2026
This agreement represents a milestone for Space Compass’s optical data relay service. For Swissto12, the contract represents further validation of the company’s ability to unlock a wide range of space missions with its small GEO satellite platform.

March 30, 2026
Aechelon’s technology is used by the US military and allies to train pilots and test advanced aircraft and autonomous systems before live flight, and supports a range of critical national security platforms.

Inova_PhysicalAI

March 30, 2026
The advanced robotic arm reference platform combines the expertise of Inova, MIPS and GlobalFoundries to build an advanced Physical AI building block that aggregates data interfaces and enables multiple network topologies.

BESS

March 27, 2026
The new energy range will be supplied throughout the EU from Kinell facilities in France and Germany and is designed to meet the evolving needs of rental companies, live events, construction sites and other users of temporary and off-grid energy.

Micron-factory

March 27, 2026
Taiwan’s semiconductor industry is often discussed in terms of scale, complexity, and technological leadership. Less often, we get a closer look at how these facilities actually operate from the inside.

Saab

March 27, 2026
The MOU establishes a framework for collaboration on AI technologies in support of GlobalEye. The agreement is directly connected to the GlobalEye opportunity in Canada but would also serve existing and future international GlobalEye operators.

Sila_MOU

March 27, 2026
Under the agreement, Posco Future M plans to push advanced battery material technology further by combining the company’s cathode and anode material capabilities with Sila’s silicon anode material technology.

Herzogenrath-2

March 27, 2026
The German company plans to manufacture some of its 100/150/200 mm products in the new plant in the Penang region, mostly to address customers in Asia. The facility will include assembly and test, engineering support and local purchasing capabilities.

Kawasaki-main-office

March 27, 2026
By combining ver. 3 of the STAR architecture with a molecular model optimization technique, researchers have reduced computational resource requirements.

Space_team

March 26, 2026
The Spanish company is developing a new hypergolic bipropellant technology based on high concentration hydrogen peroxide and a proprietary green fuel, designed to replace hydrazine and its derivatives, which are highly toxic fuels.

building

March 26, 2026
Israeli foundry Tower Semiconductor and Nuvoton Technology Corporation Japan will enter into mutual long-term supply agreements, ensuring continued support for existing customers of both companies.

March 25, 2026
The South Korean tech giant is ramping up investment 22% in 2026 to retake the lead in AI semiconductors from SK Hynix, which has become the main provider of high-bandwidth memory to Nvidia.

Leyland_battery_project_Tamil_Nadu

March 25, 2026
The project would incur an investment of INR 4–5 billion (about USD 42 million–USD 53 million) and is part of investments from the Hinduja Group as per an earlier MOU signed in September 2025.

building-title

March 25, 2026
VIGO Photonics has completed the acquisition of assets from US-based InfraRed Associates. The USD 8.4 million transaction is expected to strengthen the Polish company’s position in the infrared detector market and accelerate its international expansion, particularly in the United States.

Arianespace_agreement

March 25, 2026
Slated for launch aboard Ariane 6 in the second half of 2027, the NEXUS-1 will provide in-orbit servicing capabilities, including rendezvous and docking with satellites to deliver hardware upgrades, refueling, and life-extension services.

University_battery_project

March 25, 2026
Since its launch in 2024, the Energy Storage Engine in Upstate New York has received USD 15 million from the National Science Foundation (NSF). The initiative may receive up to USD 160 million over 10 years.

STM32_microcontroller

March 25, 2026
Through a collaboration with domestic ⁠producer Huahong, STMicroelectronics has a dual supply chain, with fully processed and manufactured 40nm MCU products in China that are exact same design and technology as those made outside China.

Akiem_locomotive

March 25, 2026
The locomotives can operate both under overhead line power and on non-electrified sections using traction batteries. Siemens Mobility will deliver the first locomotives from 2029/2030.

building_logo

March 25, 2026
The agreement with NSIG subsidiaries Simgui and Simwings extends the existing licensing framework underpinning their longstanding partnership, with no new technology transfer and a joint commitment to strengthen Soitec’s SOI intellectual property rights in China.

Expo-TMP-2025-003

March 24, 2026
Evertiq Expo Tampere returns on 26 March 2026, bringing together Finland’s electronics community for a day focused on semiconductor reliability, advanced manufacturing, automation strategies, and the evolving business landscape of the European EMS industry.

flex-ground-breaking-Zalaegerszeg-2026

March 24, 2026
Flex has laid the foundation stone for a new warehouse in Zalaegerszeg, Hungary, marking a further milestone in its EUR 90 million investment project in the country.

Thermal_investment

March 24, 2026
The funding is expected to accelerate MGA’s transition from pilot deployments to full commercial rollout, enabling the Australian company to expand its workforce, fast‑track customer projects and scale manufacturing capacity.

sign-on-building

March 24, 2026
Under the partnership, Infineon will provide its advanced wide-bandgap (WBG) power semiconductors, including silicon carbide (SiC) technology, along with application engineering support for system-level integration.

Alif_partnership

March 23, 2026
Brilliant Labs’ Halo Glasses will be powered by Alif Semiconductor’s Balletto B1 MCU, an ultra-low-power microcontroller with a dedicated Neural Processing Unit (NPU) that enables on-device AI processing.

Fuse_EDA

March 23, 2026
Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse EDA AI Agent manages workflows across Siemens’ comprehensive EDA portfolio.

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