SMT & Inspection | August 13, 2007
New rework system from OKI
OK International Launches New APR-5000-DZ Array Package Rework System with Dual Convection Bottom-side Heating for lead-free rework and high thermal demand applications.
Latest APR-5000-DZ Array Package Rework System enhances and enables fast ramp and tighter delta temperature control for lead-free rework without affecting adjacent and underside components; system expands capability to rework odd-form and temperature sensitive components; intuitive software and user prompts simplify training and provide repeatable process control.
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