Indium Corporation wins Global Technology Award

Sponsored by Global SMT & Packaging magazine, the award acknowledges outstanding innovations in the printed circuit assembly and packaging industries. It was presented at Assembly Technology Expo in Rosemont, Illinois USA. Indium5.1AT is an air reflow, no-clean solder paste that provides increased finished goods reliability when compared to competitive solder pastes. It features ultra low voiding (in the 5% range) when soldering BGAs with micro via-in-pad designs. No other solder paste is known to exceed this level of performance. In addition, Indiumt5.1AT was specifically formulated to minimize the impact of downtime on printed deposit volumes, ensuring a consistently high reliability on board assembly. This gives customers increased reliability while at the same time saving them money.