ACDi’s adds Koh Young equipment to NC plant

Equipment includes a Koh Young KY8030-3 3D solder paste inspection machine and Zenith Alpha HS 3D AOI system. The Industry 4.0-capable SPI system, which will interface with the factory’s Juki G-Titan automated printing system, will reduce the screen printer cycle time while enabling 100% 3D real time total board paste inspection, with the ability to prompt immediate operator process engagement and equipment adjustment as necessary. With the Zenith Alpha, following 3D SPI process verification, capability now validates not only 2D component placement accuracy related to presence, X/Y alignment, orientation and character recognition, but also enables third dimension imaging to verify Z-height factors including coplanarity, lifted leads, discrete SMD head-in-pillow (HiP), bridging, and overall solder joint integrity (insufficient or excess).