R&D Circuits updates its equipment

R&D Circuit's Director of Engineeing, Dan Turpuseema, cites the need for extremely high registration precision for his customers’ multilayer pcbs. R&D Circuits must manufacture circuits of up to 70 layers including high TG / Low Signal Loss / Impedance Controlled Multilayers containing FR4 as thin as 1 mil (25microns) as well as exotic materials such as Rogers, Arlon, Isola P96 (P97) and copper-clad Aluminum Core. "We've found upon evaluating the InduBond 130N equipment and process very tight registration tolerances and high process repeatability and an excellent workmanship. This new process/equipment combine simplicity and flexibility to register and bond any material in any thickness we require" said Mr. Turpuseema " this piece of equipment have a great ROI due to yield improvement, labor, time and material savings"