© alexandr malyshev dreamstime.com Electronics Production | November 07, 2013
SAI ups on cababilities
Spectrum Assembly Inc.has added wire bonding and encapsulation capability. This investment follows an agreement with Digirad Corporation.
“Digirad has awarded an exclusive agreement to SAI to outsource the manufacturing of its advanced, solid-state nuclear imaging camera gantries. Under the terms of the agreement, SAI is building all printed circuit board assemblies (PCBAs) cable and wire harnesses, wire bonding and encapsulated modules,” said Mike Baldwin, SAI’s vice president. SAI is utilizing a Hesse and Knipps Bondjet 820 unit, a Century Series Nordson Asymtek dispensing system for epoxy and a Metcal APR5000 rework soldering system. This equipment enables the Company to now dispense die attach adhesive, affix the die, wire bond and then encapsulate the wire-bonded modules. “We look forward to offering this capability to additional customers with chip-on-board requirements,” added Baldwin.