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Electronics Production | November 10, 2011

Teknek makes contact cleaning a priority

Making its debut at the show will be Teknek’s new patent pending EcoFilm product.
EcoFilm product is the first Oxydegradable clean machine adhesive roll to be available on the market. It retains all the benefits of the Teknek Nanocleen+ adhesive roll (silicone free, static dissipation, extra wide format, slant cut) plus the added advantage of being “green”.
Teknek: Hall A3, Booth #121
“The launch of the EcoFilm range will help our customers comply more easily with their environmental responsibilities,” said Ruaridh Nicolson, Teknek’s sales and marketing manager. “As circuits become ever smaller the need to use efficient contact cleaning equipment becomes a greater priority. Increasingly smaller stencil apertures mean that smaller particles can block the opening leading to production problems. Furthermore with BGA boards becoming more common, numerous solder problems can arise if the board is not 100% clean. Our equipment offers a very rapid return on investment usually within months depending on production volumes. Before and after evidence using AOI and SPI equipment demonstrates a dramatic reduction in defective boards if contact cleaning is applied at key stages of the production process.”
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