Neways to package Melexis pressure sensors in multi-year deal
Neways has signed a multi-year partnership with Melexis covering the packaging of Melexis’ Triphibian pressure sensors. The sensors are used in thermal management for electric vehicles and AI data centres.
Triphibian sensors are MEMS devices that measure pressure directly in liquids as well as gases. The package that protects the sensor chip largely determines how accurate and durable the sensor is, and how efficiently it can be produced at scale, according to a press release from Neways. Engineers from both companies worked together to develop a compact package designed to perform reliably in tough conditions.
“A MEMS sensor chip is only as good as the package around it, especially when it has to measure pressure directly in liquids. By working side by side with Melexis from the start, our engineers solved a particularly demanding packaging challenge. Advanced packaging is a strategic focus for Neways,” says Hans Büthker, CEO of Neways.
For Neways, the deal is part of a push into advanced packaging for semiconductor and sensor companies. According to the company, the packaged sensor could also be used in other applications that need compact and reliable pressure sensing.
“We selected Neways as our development partner because they bring deep packaging expertise early in the development, when the key design choices are made,” says Marc Biron, CEO of Melexis.
The companies have not disclosed the value of the agreement, its duration or the expected volumes.
