E&R opens Malaysia plant to expand packaging materials production
This expansion will further strengthen Taiwanese firm E&R Engineering Corp’s supply capabilities in Southeast Asia, delivering real-time technical support and supply chain flexibility to semiconductor and OSAT customers.
E&R Engineering Corp., a Taiwanese provider of semiconductor packaging equipment, has announced the opening of its new Malaysian subsidiary—E&R Semiconductor (MALAYSIA) SDN. BHD.
The new facility is currently undergoing sample testing and qualification, with mass production scheduled to officially begin early next year, the company said.
The plant is expected to create 50 local job opportunities, driving regional economic and industrial development. This expansion will further strengthen E&R’s supply capabilities in Southeast Asia, delivering real-time technical support and supply chain flexibility to semiconductor and OSAT (Outsourced Semiconductor Assembly and Test) customers, the company said.
“The inauguration of our Malaysia plant marks a milestone in the global deployment of our carrier tape business. To address growing customer demand in Southeast Asia, we have shifted part of our production focus to Malaysia while expanding our capacity,” said E&R Engineering President KS Chen. “Furthermore, this facility serves as a dedicated local hub for E&R’s semiconductor equipment engineers and Field Service Engineers.
“The completion of our new facility allows us to stay closer to our customers, offering real-time support and superior service,” said AK Ong, General Manager of the Malaysia plant. “We remain committed to delivering top-quality products and strictly monitoring every quality checkpoint to create a win-win future for all.”
