AT&S expands agreement with Marvell Technology for AI infrastructure
Austrian IC substrate and PCB manufacturer AT&S has signed an expanded long-term agreement with semiconductor company Marvell Technology to supply advanced IC substrates for next-generation AI and cloud infrastructure.
Marvell Technology is the additional customer AT&S previously identified in connection with the expansion of its manufacturing site in Kulim, Malaysia. The expansion includes the fit-out of Plant 2 and the construction of a new facility for IC substrate cores and advanced packaging, according to a press release.
The deal reflects broader structural shifts in semiconductor design. The transition from monolithic chips to chiplet-based designs is increasing the need for advanced substrates across a wider range of applications — from custom AI accelerators to heterogeneous computing platforms. AT&S points to larger substrate formats, higher integration density and increased layer counts as key drivers.
"Marvell Technology is one of the semiconductor industry’s leading innovators in AI and data infrastructure, and together we are well positioned to capture the significant opportunities created by the global build-out of AI infrastructure," said Michael Mertin, CEO of AT&S.
The Kulim expansion is backed by long-term customer commitments, with Marvell Technology now confirmed as the customer AT&S previously identified in connection with the expansion.
"As our data centre business continues to expand, securing the manufacturing capacity and advanced technology capabilities required to support our customers remains a critical priority," said Vinay Krishna, Senior Vice President and Chief Supply Chain Officer at Marvell Technology.
