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PCB | June 24, 2009

Cookson opens Hungarian Solder Paste Facility

Cookson Electronics Assembly Materials (CEAM) has formally opened its new Alpha Solder Paste production plant in Dunaharaszti Hungary.
The new, 1500 m2 facility has taken just over a year to complete and is totally self sufficient in both solder paste and paste flux production.

Designed on flow-line principles with an emphasis on Lean Manufacturing, the new “clean” manufacturing plant has a capacity of some 350,000 kg of solder paste per annum together with the requisite volumes of paste flux. Leaded & Lead-Free manufacturing areas are physically segregated in order to accommodate RoHS requirements.



The new production unit is attached to the existing Cookson Electronics facility that already accommodates a sales office, technical laboratories and a laser cut stencil manufacturing operation.

Based on the outskirts of Dunaharaszti, some 30 minutes SW of the capital Budapest the new plant is strategically located to service & support the numerous OEM’s & Subcontractors in the region.

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