PCB | May 14, 2008
Update: AT&S plans to issue a corporate bond
Austrian based PCB producer AT&S plans to issue a corporate bond within the next weeks.
The management of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft has decided to issue, depending on the market environment, within the next weeks a corporate bond with a volume of EUR 80 million (with the possibility to increase the volume) and a tenor of five years. Unicredit Group (BA-CA) will act as lead manager.
AT&S spokesperson Hans Lang told evertiq, that the bond will be used as short-term debt for refinancing.
AT&S spokesperson Hans Lang told evertiq, that the bond will be used as short-term debt for refinancing.
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