Components | August 16, 2011
Toshiba to cut semi line-up
Toshiba is to narrow its variety of semiconductors by the end of the year.
Several reports suggest that the Japanese flash memory maker will reduce its semiconductor line-up by 50% - from currently 6'000 types. This will mainly affect those relating to the electronics and automotive sectors.
WĂĽrth Elektronik eiSos to build technology center in Munich
WĂĽrth Elektronik eiSos is investing a nine-figure sum in its “HIC – High-Tech...
24M raises $21.8M to accelerate development and deployment
24M say it has raised a USD 21.8 million Series D to accelerate the deployment of its...
Vesper adds Digi-Key as new distributor
Acoustic sensor developer, Vesper, says that it has added Digi-Key Electronics as one of its...
Autotalks validates C-V2X chipsets using Rohde & Schwarz equipment
V2X communication solutions provider, Autotalks, and Rohde & Schwarz are validating...
Qualcomm to slim down its San Diego workforce
In two separate WARN filings to the California Employment Development Department...
Samsung's USD 46.8bn match Intel and TSMC's combined USD 48.4bn
Samsung is expected to have the largest capex budget of any IC supplier again in 2018. After...
CSA Catapult appoints CTO
The Compound Semiconductor Applications Catapult in South Wales announces the...
Heidenhain establishing an ETEL facility in Fremont
As the Silicon Valley in California and the West Coast continue to be the hub of the semiconductor...
Smarteq opens subsidiary in France
Swedish Smarteq Wireless AB is increasing its local presence in France by setting up Smarteq...
NEXT Biometrics and LastMile Mobi to develop biometric-enabled...
Norwegian fingerprint technology company, NEXT Biometrics, has entered into a...
Qualcomm wins ruling in China – banning some iPhone sales
The Fuzhou Intermediate People’s Court in China orders an immediate ban on import...
Data Respons signs contract with Norwegian customer
The contracts comprise R&D Services, software development and Smarter...
Nexans secures a EUR 111 million cable project
ADMIE has awarded Nexans a EUR 111 million contract for an interconnector between the...
Kemet CFO to retire
William M. Lowe, Jr., Executive Vice President and Chief Financial Officer for Kemet, has...
Smiths Detection checkpoint lanes chosen for Israeli airports
Smiths Detection and its local distributor, Eastronics, have been selected by the Israel...
Ultra divests its Airport Systems business to ADB SAFEGATE
Ultra has agreed to sell its Airport Systems business to ADB SAFEGATE for a total...
Micron expands in Asia – to build new facility in Malaysia
The Penang government announces that Micron Technology is planning to build a new center of excellence for SSD assembly and test in the state's Batu Kawan Industrial Park.
Anvo-Systems Dresden and Mouser sign distribution agreement
Anvo-Systems Dresden GmbH, specialist for non-volatile memory products, and Mouser...
Lockheed Martin gets NASA contract
NASA have selected Lockheed Martin's McCandless Lunar Lander to provide payload...
Experts are investigating the cause of the fire at Prodrive
On Saturday December 1st around 4 AM a fire has hit one of the buildings of Prodrive...
Superior flexibility of RS485-networking transceiver saves board...
The STMicroelectronics STR485LV 3.3V transceiver for RS485[1] applications enhances...
ASML expects delivery delays in 2019 due to fire at supplier
ASML says in an update that the company expects some delay in deliveries during the start of...
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