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AT&S plans billion-dollar investment for AI substrates in Malaysia
Austrian printed circuit board and IC substrate manufacturer AT&S plans to invest up to €2 billion in expanding its production capacities for high-end IC substrates in Malaysia, according to a company insider disclosure from June 13. US semiconductor group AMD and another leading technology customer are set to receive additional substrates from Kulim in the future. AT&S is responding to high demand for substrates used in AI computing infrastructure and high-performance computing

