Rapidus launched two semiconductor development centers in Japan

Japanese Rapidus is expanding its R&D infrastructure. The company announced the launch of two new facilities supporting semiconductor technology development: the Analysis Center and Rapidus Chiplet Solutions (RCS). Both plants are intended to accelerate preparations for the production of advanced integrated circuits planned for 2027. The Analysis Center was established adjacent to the IIM-1 semiconductor factory in Chitose (a city in southern Hokkaido). This facility handles key research processes for developing modern logic chips, including physical analysis, environmental and chemical testing, electrical characterization, and reliability assessments. RCS serves as an R&D center for advanced semiconductor packaging. The unit began operations in October 2024 at the Seiko Epson Corporation plant in Chitose. Following the completion of a cleanroom in 2025, equipment installation commenced. Work has so far been conducted on a limited scale, including the production of a prototype 600mm RDL interposer panel. RCS is now transitioning to full operational scale. This expansion of research infrastructure aims to strengthen Rapidus's development capabilities and ensure a smooth transition to mass production of advanced semiconductors, a goal the company aims to achieve in the second half of fiscal year 2027