Celestica and AMD partner on new AI infrastructure platform

Celestica and AMD have announced a strategic collaboration to bring the new "Helios" platform for AI infrastructure to market. The goal is to provide scalable solutions for deploying artificial intelligence in data centers, enterprises, and research institutions. As part of the cooperation, Celestica will handle the development, design, and manufacturing of network switches within the "Helios" architecture, which is based on open standards and designed to efficiently connect large-scale AI clusters. The platform uses advanced networking technologies to interconnect next-generation high-performance GPUs, enabling the processing of large data volumes for AI applications. "Delivering AI at scale requires infrastructure that can be deployed quickly and reliably," explained Steven Dorwart of Celestica, noting that the partnership combines manufacturing and supply chain expertise with high-performance computing technology. AMD also sees "Helios" as a new approach to AI infrastructure, aiming to improve performance, efficiency, and flexibility for future applications. The platform is expected to be available from the end of 2026, helping companies implement AI systems faster and strengthen their supply chain resilience. This collaboration is a response to the rapidly growing demand for powerful AI infrastructure, positioning both companies in the expanding market for data center and AI technologies