Aspocomp installs new copper plating line

The Finnish PCB manufacturer Aspocomp has installed a new copper plating line as part of an ongoing factory expansion program exceeding 10 million euros. According to a LinkedIn post by the company's COO Pekka Holopainen, the new line combines chemical (electroless) and electrolytic copper plating in a continuous process flow. Aspocomp states this solution will improve process control, reliability, and capacity in PCB production. The process merges a thin chemical copper layer with 3–5 micrometers of electrolytic copper, which the company says enhances the quality of plated through-holes and enables stable production of more complex circuit boards. The investment reportedly increases copper plating capacity by about 1.5 times, contributing to shorter lead times and higher throughput. The new line also includes automation features with machine learning-based production optimization. This copper plating line is part of Aspocomp's plan to increase total production capacity by over 50%. The project is co-financed by the European Union through the Just Transition Fund (JTF), with the Northern Ostrobothnia ELY Centre as the responsible authority