TSK Schill presents sustainable etching solutions for the PCM industry

At the PCMI Fall Conference 2025 in Tacoma, Washington, TSK Schill presented new solutions for optimizing horizontal wet chemical etching processes. A key focus was the technological partnership with KSD Innovations, whose regeneration systems are an integral part of the showcased process chain. TSK exhibited advanced vacuum etching systems for processing stainless steel, high-performance alloys, copper, and precision metals. The systems are designed for applications in medical technology, aerospace, sensor technology, and microstructuring. Combined with KSD's regeneration technologies, they create a closed-loop process aimed at higher stability and extended bath life for the process chemistry. The systems monitor key parameters such as redox potential, density, conductivity, and pH via a Siemens PLC control, targeting reproducible process control and a reduction in chemical consumption and disposal costs. TSK and KSD emphasize that this integrated approach is intended to enable more sustainable and efficient production for PCM industry operations. Both companies are pursuing the expansion of global activities with a focus on complete solutions for photochemical manufacturing processes