Micron introduces 192GB SOCAMM2 module for energy-efficient AI data centers

Micron Technology has introduced its highest-capacity low-power DRAM module to date with the 192-GB SOCAMM2. The new module is based on Micron's advanced 1-gamma DRAM process technology and, according to the company, offers over 20% better energy efficiency—a key factor for optimizing large AI data center clusters. The second generation of SOCAMM modules delivers 50% more capacity in the same compact form factor and is expected to further drive the adoption of low-power memory technologies in the AI space. Compared to previous solutions, SOCAMM2 can reduce the Time-to-First-Token (TTFT) for inference workloads by over 80%