Hofstetter PCB Group invests in Adeon's via-filling tech and Mass-PCB

Hofstetter PCB Group is expanding its manufacturing capacity and has acquired a via-filling and planarization system from Mass-PCB via Adeon Technologies. The new line will be installed at SMF Hofstetter in Herrenberg after Productronica in Munich (November 18–21, 2025). Following tests at Mass-PCB's demonstration center, this next-generation system, based on 20 years of development, combines vacuum technology with process-controlled resin application to achieve uniform, bubble-free via filling, even for complex board designs. A subcontracting service will launch in January 2026, using paste from Lackwerke Peters. The VCP M+ 5000-1 system uses a fully evacuated chamber to remove air and gases before filling vias under controlled pressure, ensuring high process reliability. This investment strengthens Hofstetter's role as a technical service provider for the European PCB industry, promoting regional manufacturing independence