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PCB | August 24, 2007

Report BPA: Flexible Circuits Industry

High value flex and flex-rigid substrates are key components in future generations of electronics for certain medical, military, aerospace, computer and communications
applications.
The market for flex and flex-rigid printed circuit boards for all sectors has increased from $2 billion in 2001 to more than $7 billion in 2006. The higher-value segment accounts for one-fifth of this.

The statistic shows the forecast for the worldwide demand for flex and flex-rigid circuits for 2006-2008 in US$.



The purpose of this report is to review in more details those applications which belong to the
high-end substrate segment. These will be applications where technology requirements are
more demanding such as finer features, high layer counts, thinner materials, applications
where military standards for reliability must apply or where a new market is emerging.

For more information please email s.demmon@bpaconsulting.com
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