Electronics Production | June 19, 2007
Russia plans to construct wafer fab
Russia is together with “Kedah Group" planning to construct a 300-mm wafer fab at Nizhny Novgorod.
Alexander Kalinin, deputy chairman for the Russian Federal Fund for Electronics announced these plans in a presentation he held. The fund has budgeted $700 million as a grant for this project. The constitution of Kedah Group is not set yet but Kedah is a Malaysian state which includes Kulim where there is a technology park. The Kulim Hi-tech Park (KHTP) tenants include Silterra, Intel, Infineon, Fuji Electric and AIC Semiconductor. Kedah Group will construct wafer fabrication facilities capable of 8-inch and 12-inch manufacture at up to 30,000 wafer starts per month. The facility would manufacture circuits using 0.18-micron down to 90-nanometer manufacturing processes.