Manncorp presents Lead Free 5-Zone Reflow<br>Oven for Mid-Volume PCB Assembly

This system features 10 reinforced PID temperature controllers in each of the five upper and lower chambers to precisely profile critical solder paste reflow parameters. For added compatibility with the extremely high temperatures of lead-free, there are three thermocouple inputs for real-time monitoring of component and PCB temperatures. Additional thermal management is provided by controls for cooling zone temperature and belt speed. The computer-controlled R-500 is available with 16" stainless steel mesh belt or a combination mesh belt and adjustable edge pin conveyor for double-sided boards. The system relies on forced air convection for uniform edge-to-edge.