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SMT & Inspection | November 20, 2006

Camtek land order from Casio

Camtek reported that Casio has qualified Camtek's Falcon Bumped Wafer Metrology system for monitoring the bumping process in Casio's unique wafer-level Chip-Scale Packaging (WLP) technology.

Casio is using several Falconsystems for this particular semiconductor packaging process. Mr. Takeshi Wakabayashi, General Manager of the Advanced Packaging Technology Department at Casio Computer, commented, "The key to Casio's WLP technology is protecting the surface and copper redistribution layer by post-sealing with epoxy resin. The contrast and variations in reflectivity between these materials create difficulties for ordinary optical inspection systems. Camtek's Falcon has proven its ability to successfully handle this technology, and is providing us with the consistent measurements we expect." "The market for bumped wafer metrology is very demanding," said Avishai Shklar, General Manager of Camtek Japan.
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May 21 2019 9:58 pm V13.3.9-2