SMT & Inspection | November 20, 2006

Camtek land order from Casio

Camtek reported that Casio has qualified Camtek's Falcon Bumped Wafer Metrology system for monitoring the bumping process in Casio's unique wafer-level Chip-Scale Packaging (WLP) technology.
Casio is using several Falconsystems for this particular semiconductor packaging process.
Mr. Takeshi Wakabayashi, General Manager of the Advanced Packaging Technology Department at
Casio Computer, commented, "The key to Casio's WLP technology is protecting the surface and
copper redistribution layer by post-sealing with epoxy resin. The contrast and variations in
reflectivity between these materials create difficulties for ordinary optical inspection systems.
Camtek's Falcon has proven its ability to successfully handle this technology, and is providing us
with the consistent measurements we expect."

"The market for bumped wafer metrology is very demanding," said Avishai Shklar, General Manager
of Camtek Japan.


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