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NPL study copper dissolution

The National Physical Laboratory, NPL, UK is to launch a project on the topic of copper dissolution in lead-free soldering systems.

It is well-known that copper dissolution can be increased in lead-free soldering, both in processing and rework. This study aims to quantify the effects using a range of solders at various temperatures in different PCB configurations. The results will be used to develop a monitoring technique as well as a best practice guide, including a test method. Participation is open to UK organisations and a kick-off meeting is to be held on 7th December. Click Here for more information (PDF).

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March 28 2024 10:16 am V22.4.20-1
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