PCB | November 13, 2006

NPL study copper dissolution

The National Physical Laboratory, NPL, UK is to launch a project on the topic of copper dissolution in lead-free soldering systems.
It is well-known that copper dissolution can be increased in lead-free soldering, both in processing and rework. This study aims to quantify the effects using a range of solders at various temperatures in different PCB configurations.

The results will be used to develop a monitoring technique as well as a best practice guide, including a test method.

Participation is open to UK organisations and a kick-off meeting is to be held on 7th December.

Click Here for more information (PDF).


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Further details can be found here.
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