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PCB | November 01, 2006

Flex Circuits Bend to Fit More Applications

Merely a novelty just a few years ago, flexible circuits have moved into mainstream use in many applications.
Designers are deploying flex circuits for high-volume, surface-mount PCB applications, as well as for array and stacked IC packaging techniques, such as flip-chip, micro-ball grid array (BGA), tape BGA (TBGA), 3D, chip-scale packaging (CSP) and system-in-package (SiP).

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