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PCB | October 11, 2006

Is HAL viable for Pb-free assemblies?

Until recently more than 80% of all PCBs produced worldwide were hot air leveled. Today, still more than 60% of all PCBs undergo HAL. Yet most studies conducted so far used PCBs with finishes of ENIG, immersion silver, immersion tin and organic solder preservative (OSP). Pb-free hot air leveled PCBs invariably have been excluded.
Numerous Pb-free alloys can be eliminated from consideration for use in HAL and assembly (wave soldering and paste) for reasons of cost, availability of alloy constituents, compatibility with other solder alloys or soldering processes, or reliability considerations. Click here for the full article.
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