Electronics Production |
Control and Stability in Lead-free Reflow
It seems as though it was more than 15 years ago that the SMT industry migrated from organic acid-based solder pastes and rosin to the less-forgiving realm of low-solid, no-clean formulations.
Then the evolution from air to a nitrogen process expanded the reflow process window - allowing production that generated little to no flux residue. For many manufacturers, this meant retiring the cleaning process altogether, eliminating the need for these machines, and reducing production hours significantly.
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