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Electronics Production | October 05, 2006

Control and Stability in Lead-free Reflow

It seems as though it was more than 15 years ago that the SMT industry migrated from organic acid-based solder pastes and rosin to the less-forgiving realm of low-solid, no-clean formulations.

Then the evolution from air to a nitrogen process expanded the reflow process window - allowing production that generated little to no flux residue. For many manufacturers, this meant retiring the cleaning process altogether, eliminating the need for these machines, and reducing production hours significantly. Click here to read the full story.
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