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Electronics Production | September 01, 2006

Yet Another Way to Use BCB

Benzocyclobutene (BCB) is a widely used dielectric in wafer-level packaging and redistribution applications.
Researchers at the Automation and Robotics Research Institute at the University of Texas at Arlington have performed proof-of-concept work on a novel flip-chip on chip method in which photo-BCB is used as an adhesive that performs some of the functions of an underfill. They presented results of their work at this year's IMAPS Device Packaging Conference.

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