Material | August 23, 2006
Testing times for lead-free alloys
REMOVING lead from electronics may be a good idea, but the transition to lead-free solder does dramatically alter the electronics assembly procedure, particularly for high-reliability products.
Tin/lead solder joints have been comprehensively characterised over many decades, and manufacturers of products for safety-critical or life-dependent applications are able to reassure their reliability. This is not the case for lead-free alternatives. Although staff at standards bodies such as the Association Connecting Electronics Industries (IPC) and the International Electrotechnical Commission (IEC) have devoted many man-months to characterising solder joints formed using their recommended lead-free alloys, there is much more to do. Click here to read the full article at ferret.com.au.