Material |
New material set from Henkel
Henkel has announced a materials combination designed specifically for the unique manufacturing requirements of stacked CSP (SCSP) devices.
Uniting the robust performance characteristics of die attach material Hysol® QMI536NB with that of mold compound Hysol® GR9820, this latest material set delivers proven, reliable JEDEC Level 1/260° reflow performance.
Both materials perform well in lead-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. Hysol® GR9820 is an extremely versatile and technologically advanced epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations, delivering tremendous production flexibility.
