Ad
Ad
Ad
Ad
Ad
Ad
Ad
Ad
Material |

New material set from Henkel

Henkel has announced a materials combination designed specifically for the unique manufacturing requirements of stacked CSP (SCSP) devices.

Uniting the robust performance characteristics of die attach material Hysol® QMI536NB with that of mold compound Hysol® GR9820, this latest material set delivers proven, reliable JEDEC Level 1/260° reflow performance. Both materials perform well in lead-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. Hysol® GR9820 is an extremely versatile and technologically advanced epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations, delivering tremendous production flexibility.

Ad
Ad
Load more news
March 28 2024 10:16 am V22.4.20-1
Ad
Ad