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Boyd Corp. nabs titanium-based MEMS developer
Boyd Corporation, a provider of thermal management, environmental sealing and protection solutions, has acquired PiMEMS, an advanced R&D organization developing titanium micro technologies and ultra-thin devices. Terms of the deal have not been released.
PiMEMS, formed in 2012 in Santa Barbara, brings intellectual property in micro- and nano-metal fabrication, specializing in titanium alloys, to construct metal-based micro devices. In light of the trend toward smaller, lighter devices with greater power demands, PiMEMS technology aids the design and manufacture of high-performance microelectronics and ultra-thin thermal solutions that can exceed evolving performance needs, a press release stated.
Boyd CEO Mitch Aiello said, “Industries from aerospace to mobile electronics consistently push for higher powered devices in more streamlined configurations, translating to thermal management demands that are lighter and more compact with enhanced thermal performance. We’ve bolstered our market-leading R&D resources with a broad portfolio of titanium micro technology that enables higher performing thermal solutions that are lighter and thinner than anything else on the market.”
Formed in 1928 and headquartered in the San Francisco Bay Area, Boyd Corporation has multiple locations across North America, Asia and Europe.
