© otnaydur dreamstime.com Electronics Production | March 27, 2019
Huawei chooses Universal to automate complex server assembly
Huawei Technologies has chosen Universal Instruments’ FuzionOF Platform to automate complex component placement in its server board applications. They have begun scaling FuzionOF in production, replacing manual assembly processes and realising output gains.
Huawei selected FuzionOF based on the platform’s speed, repeatability and ability to handle a broad range of components on a single platform, maximising automation ROI. The new platforms form the foundation of Huawei’s Golden Server production line. They are automating insertion of 16 unique pin-in-paste odd-form components, including VGAs, RJ45s, SATA and PCIE connectors, pin headers, electrolytic capacitors (e-caps), and more. The FuzionOF solution also includes bowl, radial, tray, and track feeder integration, a press release reads. By transitioning to the FuzionOF solution, Huawei has seen significant improvements. Daily printed circuit board (PCB) output has more than tripled, while the first-pass yield rate has been more than 99.5% and downtime less than 1%. “We’re thrilled to work together with a world-class partner like Huawei,” says Universal Instruments Vice President of Customer Operations, Brad Bennett, in the release. “Automation continues to drive the electronics assembly landscape and we’ve developed our portfolio to meet this challenge head-on. More importantly, we’re positioned to help our customers embrace automation and fortify their leadership positions.”