Electronics Production | June 28, 2006
Reduce Joint Cracks in Automotive Electronics
The RoHS Directive comes into force in one month, and many manufacturers have adopted SAC solder alloys for lead-free consumer appliance production. However, durability is an issue as cracks in SAC joints progress quickly.
A higher-reliability lead-free solder was designed to withstand harsh on-board automotive electronics environments. As the European Union's (EU's) RoHS Directives come into force in July 2006, the transition to lead-free solder is occurring at an increasingly rapid pace. Many manufacturers have adopted Sn/Ag/Cu (SAC)-type solder alloys as a representative lead-free solder for consumer appliance production. The mechanical properties of SAC solder differ greatly from those of conventional tin/lead solder. At the beginning of lead-free substitution, SAC alloys displayed high creep strength. Click here to read the full story at SMT.